Patents by Inventor John C. Wynbeek

John C. Wynbeek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6853835
    Abstract: A wireless communication system and method are provided, where a base station communication device includes a carrier wave-based transmitter and an ultrawideband receiver. A mobile communication device includes a carrier wave-based receiver and an ultrawideband transmitter. Carrier wave communications are carried out in a forward channel from the base station communication device to the mobile communication device, and ultrawideband communications are carried out in a reverse channel from the mobile communication device to the base station communication device. As a result, the power requirements of the mobile communication device are significantly reduced.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: February 8, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: John C. Wynbeek
  • Publication number: 20030032422
    Abstract: A wireless communication system and method are provided, where a base station communication device includes a carrier wave-based transmitter and an ultrawideband receiver. A mobile communication device includes a carrier wave-based receiver and an ultrawideband transmitter. Carrier wave communications are carried out in a forward channel from the base station communication device to the mobile communication device, and ultrawideband communications are carried out in a reverse channel from the mobile communication device to the base station communication device. As a result, the power requirements of the mobile communication device are significantly reduced.
    Type: Application
    Filed: August 13, 2001
    Publication date: February 13, 2003
    Inventor: John C. Wynbeek
  • Patent number: 5633535
    Abstract: A method of forming standoff spacer pedestals on a device above the substrate by supporting the electronic device with the standoff spacer pedestals during solder reflow and bonding. Generally, the method comprising the steps of adhering at least one layer of film solder resist on the substrate, and eliminating the undesired portions of dry film solder resist to form the pedestals.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: May 27, 1997
    Inventors: Clinton C. Chao, Timothy V. Harper, John C. Wynbeek, Eric S. Schneider