Abstract: A method for forming terminations on the opposite ends of a chip component includes placing a chip component in a cavity with one end of the chip component exposed. Termination conductive material is then deposited on the exposed end of the chip component and the component is removed from the cavity and reversed. Termination material is then deposited on the other exposed end. One modification of the invention includes extending the chip components completely through holes in a plate so that the opposite ends of the chip component are exposed. The termination material is then placed on the opposite ends of the chip component.

Abstract: A first mold die and a second mold die are moved together and are shaped to define a mold cavity therebetween. A capacitor pellet is positioned within the mold cavity and a plurality of projections extend inwardly to engage the capacitor pellet and hold it spaced away from the cavity side wall. The method comprises placing the pellet body within the cavity molding and retentively engaging the pellet body with a plurality of projections to provide a space between the pellet body and the cavity side wall. A molding material is used to fill the space to provide a coating on the pellet body.

Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.