Abstract: The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.

Abstract: A lavatory complex for an aircraft. The lavatory complex includes a male lavatory facility and a female lavatory facility. The male lavatory facility includes stall units and may include urinals. The female lavatory facility includes stall units. Each stall unit suitably includes a single commode. The male and female lavatory facilities include at least one sink separated from the stall units by stall unit doors. The lavatory complex may include sinks that are not located within either the male or female lavatory facilities. A lavatory may include illuminating indicators; an illuminated, folding, baby changing station; a vanity; a self-cleaning toilet; and/or an illuminated faucet.

Abstract: Disclosed is a method of controlling and managing a process control system having a plurality of control loops. The method includes implementing a plurality of control routines to control operation of the plurality of control loops, respectively. The plurality of control routines may include at least one non-adaptive control routine. Operating condition data is then collected in connection with the operation of each control loop of the plurality of control loops, and a respective process model is identified for each control loop of the plurality of control loops from the respective operating condition data collected for each control loop of the plurality of control loops. In some embodiments, the identification of the respective process models may be automatic as a result of a detected process change or be on-demand as a result of an injected parameter change.

Abstract: Disclosed are compounds of the formula I or a stereoisomer, tautomer, or pharmaceutically acceptable salt or solvate thereof, wherein W is a bond, —C(?S)—, —S(O)—, —S(O)2—, —C(?O)—, —O—, —C(R6)(R7)—, —N(R5)— or —C(?N(R5))—; X is —O—, —N(R5)— or —C(R6)(R7)—; provided that when X is —O—, U is not —O—, —S(O)—, —S(O)2—, —C(?O)— or —C(?NR5)—; U is a bond, —S(O)—, —S(O)2—, —C(O)—, —O—, —P(O)(OR15)—, —C(?NR5)—, —(C(R6)(R7))b— or —N(R5)—; wherein b is 1 or 2; provided that when W is —S(O)—, —S(O)2—, —O—, or —N(R5)—, U is not —S(O)—, —S(O)2—, —O—, or —N(R5)—; provided that when X is —N(R5)— and W is —S(O)—, —S(O)2—, —O—, or —N(R5)—, then U is not a bond; and R1, R2, R3, R4, R5, R6, and R7 are as defined in the specification; and pharmaceutical compositions comprising the compounds of formula I.

Abstract: An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

Abstract: Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.

Abstract: Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Abstract: Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Abstract: Disclosed are compounds of the formula I or a stereoisomer, tautomer, or pharmaceutically acceptable salt or solvate thereof, wherein W is a bond, —C(?S)—, —S(O)—, —S(O)2—, —C(?O)—, —O—, —C(R6)(R7)—, —N(R5)— or —C(?N(R5))—; X is —O—, —N(R5)— or —C(R6)(R7)—; provided that when X is —O—, U is not —O—, —S(O)—, —S(O)2—, —C(?O)— or —C(?NR5)—; U is a bond, —S(O)—, —S(O)2—, —C(O)—, —O—, —P(O)(OR15)—, —C(?NR5)—, —(C(R6)(R7))b— or —N(R5)—; wherein b is 1 or 2; provided that when W is —S(O)—, —S(O)2—, —O—, or —N(R5)—, U is not —S(O)—, —S(O)2—, —O—, or —N(R5)—; provided that when X is —N(R5)— and W is —S(O)—, —S(O)2—, —O—, or —N(R5)—, then U is not a bond; and R1, R2, R3, R4, R5, R6, and R7 are as defined in the specification; and pharmaceutical compositions comprising the compounds of formula I.

Abstract: A turntable assembly to be inset in an aperture in the surface of an article of furniture. It includes a circular ring fitted in the recess and held there by a peripheral lip that rests on a peripheral band on the surface. Bearings carried by the ring face inwardly rotatable to support a plate-like turntable inside the ring.

Abstract: A rockable and stackable chaise lounge. It includes a pair of frame members each formed by a downardly convex rocker and an upwardly convex rail joined at front and rear ends. The frames are joined-at their front and rear ends by spreaders. Adjustable stops are provided to limit the extent of rocking. A seat with a reclining back is supported between the frame by the rails.

Abstract: An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

Abstract: Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Abstract: Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.

Abstract: A print media apparatus is disclosed. The print media apparatus includes a platform including a surface and a first coupling element. A plurality of electrical elements is under the surface. A processor is coupled to the plurality of electrical elements. A book is on the surface and has a spine having a second coupling element. The book and the platform are removably coupled through the first and second coupling elements.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: A lavatory complex for an aircraft is provided. The lavatory complex includes a male lavatory facility and a female lavatory facility. The male lavatory facility includes stall units and may include urinals. The female lavatory facility includes stall units. Each stall unit suitably includes a single commode. The male and female lavatory facilities include at least one sink separated from the stall units by stall unit doors. The lavatory complex may include sinks that are not located within either the male or female lavatory facilities. A lavatory may include illuminating indicators; an illuminated, folding, baby changing station; a vanity; a self-cleaning toilet; and/or an illuminated faucet.

Abstract: Interactive books are disclosed. An example includes a front cover and a rear cover. At least one page is between the front and rear covers. A binder couples the front cover, the rear cover, and the at least one page together. An antenna is in the rear cover. A stylus is coupled to either the front or the rear cover, and an output device such as a speaker is coupled to the front or the rear cover.