Patents by Inventor John Cheung-Shing Chu

John Cheung-Shing Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6379875
    Abstract: Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: April 30, 2002
    Assignee: Shipley Company, LLC
    Inventor: John Cheung-Shing Chu
  • Publication number: 20010051318
    Abstract: Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.
    Type: Application
    Filed: May 25, 2001
    Publication date: December 13, 2001
    Applicant: Shipley Company, L.L.C. of Marlborough, Massachusetts
    Inventor: John Cheung-Shing Chu
  • Patent number: 6274296
    Abstract: Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: August 14, 2001
    Assignee: Shipley Company, L.L.C.
    Inventor: John Cheung-Shing Chu