Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: Component-less termination for electromagnetic couplers used in high speed/frequency differential signaling is described. In one embodiment, the apparatus includes a first signal line and a second signal line forming a differential pair, a first electromagnetic coupler to provide sampled electromagnetic signals from the first signal line, and a second electromagnetic coupler to provide sampled electromagnetic signals from the second signal line, wherein the first electromagnetic coupler is far end short circuited and wherein the second electromagnetic coupler is far end open circuited. Other embodiments are also described and claimed.

Abstract: In at least one embodiment an apparatus is provided that includes an electromagnetic coupler to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler, to amplify and recover a derivative-like output signal, and to provide recovered sampled electromagnetic signals to an oscilloscope with a unity transfer function. Other embodiments may be described and claimed.

Abstract: Component-less termination for electromagnetic couplers used in high speed/frequency differential signaling is described. In one embodiment, the apparatus includes a first signal line and a second signal line forming a differential pair, a first electromagnetic coupler to provide sampled electromagnetic signals from the first signal line, and a second electromagnetic coupler to provide sampled electromagnetic signals from the second signal line, wherein the first electromagnetic coupler is far end short circuited and wherein the second electromagnetic coupler is far end open circuited. Other embodiments are also described and claimed.

Abstract: Testing microelectronic devices using electro-optic modulator probes is disclosed. In one aspect, a testing apparatus may include an electrical signaling medium to exchange electrical signals with a microelectronic device. The testing apparatus may include an electro-optic modulator probe to provide optical signals that are modulated by the electrical signals. An optoelectronic transducer may be included to convert the modulated optical signals to modulated electrical signals. The testing apparatus may further include a logic analyzer module to receive and analyze the modulated electrical signals. Other testing apparatus are disclosed, as well as systems incorporating such apparatus, and various methods of testing microelectronic devices.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: According to some embodiments, a signal line associated with a printed circuit board is provided. In addition, a conductive trace is electrically connected to a portion of the signal line. At least a portion of the conductive trace may be offset from the signal line, and a dielectric layer may be provided between the signal line and the conductive trace to enhance electromagnetic coupling between them. As a result a hybrid resistance and electromagnetic coupling probe may be provided.

Abstract: According to some embodiments, a signal line associated with a printed circuit board is provided. In addition, a conductive trace is electrically connected to a portion of the signal line. At least a portion of the conductive trace may be offset from the signal line, and a dielectric layer may be provided between the signal line and the conductive trace to enhance electromagnetic coupling between them. As a result a hybrid resistance and electromagnetic coupling probe may be provided.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.