Patents by Inventor John Cuendet

John Cuendet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dispensing process for fabrication of microelectronic packages
    Patent number: 6706553
    Abstract: A microelectronic package including at least one microelectronic die disposed within an opening in a microelectronic package core, wherein a liquid encapsulation material is injected with a dispensing needle within portions of the opening not occupied by the microelectronic dice. The encapsulation material is cure thereafter. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic package core to form the microelectronic package.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: March 16, 2004
    Assignee: Intel Corporation
    Inventors: Steven Towle, John Cuendet, Kyle Johnson
  • Dispensing process for fabrication of microelectronic packages
    Publication number: 20020137263
    Abstract: A microelectronic package including at least one microelectronic die disposed within an opening in a microelectronic package core, wherein a liquid encapsulation material is injected with a dispensing needle within portions of the opening not occupied by the microelectronic dice. The encapsulation material is cure thereafter. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic package core to form the microelectronic package.
    Type: Application
    Filed: March 26, 2001
    Publication date: September 26, 2002
    Inventors: Steven Towle, John Cuendet, Kyle Johnson