Abstract: A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.

Abstract: An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.

Abstract: A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.

Abstract: An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.

Abstract: A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.

Abstract: A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.

Abstract: An active needle device for fluid injection or extraction includes at least one hollow elongated shaft defining at least one channel. The channel provides communication between at least one input port and at least one output port of the needle device. At least one active component such as a sensor or actuator is placed or integrated into the elongated shaft. The needle device can include a macroneedle, a microneedle, or an array of macroneedles or microneedles. The microneedles can be fabricated on a substrate which can remain attached to the microneedles or be subsequently removed. The active component can facilitate biochemical, optical, electrical, or physical measurements of a fluid injected or extracted by the needle device.

Abstract: An active needle device for fluid injection or extraction includes at least one hollow elongated shaft defining at least one channel. The channel provides communication between at least one input port and at least one output port of the needle device. At least one active component such as a sensor or actuator is placed or integrated into the elongated shaft. The needle device can include a macroneedle, a microneedle, or an array of macroneedles or microneedles. The microneedles can be fabricated on a substrate which can remain attached to the microneedles or be subsequently removed. The active component can facilitate biochemical, optical, electrical, or physical measurements of a fluid injected or extracted by the needle device.

Abstract: Surface micro-machined micro-needles (32) are formed as single needles (32) or in two-dimensional or three-dimensional micro-needle arrays (30). The micro-needles (32) are fabricated on a substrate (12) which can remain attached to the micro-needles (32) or can be subsequently removed. The two-dimensional or three-dimensional micro-needle arrays (30) can have cross-coupling flow channels (36) which allow for pressure equalization, and balance of fluid flow within the micro-needle arrays (30). Each of the micro-needles (32) has a micro-channel (36) therethrough that provides communication between at least one input port (37) at a proximal end of the micro-needles (32), and at least on output port (39) at an opposite distal end.

Abstract: An active needle device (10) for fluid injection or extraction includes at least one hollow elongated shaft (11) defining at least one channel (12). The channel (12) provides communication between at least one input port (15) and at least one output port (16) of the needle device (10). At least one active component (17) such as a sensor or actuator is placed or integrated into the elongated shaft (1 1). The needle device (10) can include a macroneedle, a microneedle (21), or an array of macroneedles or microneedles (25a). The microneedles (21) can be fabricated on a substrate (26) which can remain attached to the microneedles (21) or be subsequently removed. The active component can facilitate biochemical, optical, electrical, or physical measurements of a fluid injected or extracted by the needle device (10).

Abstract: An array of movable MEMS mirror devices is provided being electromagnetically actuated in one axis and using an additional set of coils, or a single coil, positioned off of the main axis of rotation to achieve a second axis of rotation while allowing for a very high linear mirror fill factor (>80%). This second set of coils, or second electrically wired coil, is capable of generating the necessary torque about an axis that is perpendicular to the major axis of rotation. A second embodiment is provided using electromagnetic actuation in one axis of rotation, which typically has larger rotation angles than the second axis, and electrostatic actuation in the second axis of rotation. Electrostatic pads can be used to sense rotation. When staggering adjacent pixels a center array of mirrors with no coils or electrodes provides increased radius of curvature and reducing undesirable cross-talk between adjacent mirror devices.