Abstract: An x-y robotic motion control system includes a controller, a first rail and a second rail spaced from the first rail wherein the first and second rails are substantially parallel to one another. A gantry has a first end movable along the first rail and a second end movable along the second rail. A payload is movable along the gantry and a position sensor is movable along the gantry with the payload. A first encoder is configured to detect the first end of the gantry with respect to the first rail, and a second encoder is configured to detect the second end of the gantry with respect to the second rail. The position sensor and the first and second encoders are coupled to the controller, which calculates a position of the payload as a function of signals from the position sensor and the first and second encoders.

Abstract: A method of sensing a component held by a nozzle of a pick and place machine is provided. The method includes engaging a source of illumination and recording a reference background image when no component is held by the nozzle. Then, a component is adhered to the nozzle. A shadow image of the component is detected while the component is held by the nozzle. The detected shadow image of the component is adjusted based upon the recorded reference background image. Positional information relative to the component held on the nozzle is computed using the adjusted shadow image. The component is then mounted upon a workpiece using the positional information.

Abstract: Embodiments include measuring motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.

Abstract: An x-y robotic motion control system includes a controller, a first rail and a second rail spaced from the first rail wherein the first and second rails are substantially parallel to one another. A gantry has a first end movable along the first rail and a second end movable along the second rail. A payload is movable along the gantry and a position sensor is movable along the gantry with the payload. A first encoder is configured to detect the first end of the gantry with respect to the first rail, and a second encoder is configured to detect the second end of the gantry with respect to the second rail. The position sensor and the first and second encoders are coupled to the controller, which calculates a position of the payload as a function of signals from the position sensor and the first and second encoders.

Abstract: A method of sensing a component held by a nozzle of a pick and place machine is provided. The method includes engaging a source of illumination and recording a reference background image when no component is held by the nozzle. Then, a component is adhered to the nozzle. A shadow image of the component is detected while the component is held by the nozzle. The detected shadow image of the component is adjusted based upon the recorded reference background image. Positional information relative to the component held on the nozzle is computed using the adjusted shadow image. The component is then mounted upon a workpiece using the positional information.

Abstract: Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Abstract: An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.

Abstract: An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.

Abstract: Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Abstract: An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.