Abstract: A tool for removing integrated circuit packages from the sockets of a burn-in board includes a plurality of parallel elongated prongs spaced from one another by an amount corresponding to the distance between adjacent rows of sockets on the burn-in board. A cover including a protective layer, such as of foam material, is mounted for pivotal movement with respect to the prongs. To remove the integrated circuit packages from the burn-in board following a burn-in procedure, the prongs are inserted along the longitudinal spaces between adjacent rows of sockets and the free end of the cover is latched to the prongs. The prongs are then lifted upwards, thereby to remove the integrated circuit packages from the sockets.