Patents by Inventor John D. Mullarkey

John D. Mullarkey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal mismatch compensation technique for integrated circuit assemblies
    Patent number: 6675600
    Abstract: Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: January 13, 2004
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Gene A. Robillard, Richard S. Holland, Robert N. Graney, John W. Marciniec, John D. Mullarkey, Paul H. Rourke