Patents by Inventor John D. Voultos

John D. Voultos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoformable polymer thick film transparent conductor with haptic response and its use in capacitive switch circuits
    Patent number: 9779851
    Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: October 3, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Jay Robert Dorfman, John D. Voultos
  • THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
    Publication number: 20150279508
    Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Application
    Filed: March 17, 2015
    Publication date: October 1, 2015
    Inventors: JAY ROBERT DORFMAN, JOHN D. VOULTOS
  • NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM
    Publication number: 20140186521
    Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.
    Type: Application
    Filed: December 9, 2013
    Publication date: July 3, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: KUMARAN MANIKANTAN NAIR, Michael A. Skurski, John D. Voultos
  • Nickel-gold plateable thick film silver paste
    Patent number: 8609256
    Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: December 17, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: Kumaran Manikantan Nair, Michael A. Skurski, John D. Voultos
  • NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM
    Publication number: 20120308717
    Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.
    Type: Application
    Filed: June 6, 2012
    Publication date: December 6, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: KUMARAN MANIKANTAN NAIR, Michael A. Skurski, John D. Voultos
  • NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM
    Publication number: 20100086807
    Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 8, 2010
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Kumaran Manikntan Nair, Michael A. Skurski, John D. Voultos