Abstract: Techniques for controlling a process to prevent injury are presented. The techniques include obtaining a location estimation of a mobile transmitter affixed to an object, where the location estimation is relative to a location of a fixed receiver, and where the obtaining the location estimation includes sending an ultra wideband communication from the mobile transmitter to the fixed receiver and acquiring the ultra wideband communication by a phased antenna array of the fixed receiver; assessing, based on the location estimation, that the mobile transmitter is within an impermissible location; determining that the location estimation is sufficiently accurate based on a distance between the location estimation and the fixed receiver; and interrupting the process upon both assessing that the mobile transmitter is within an impermissible location and determining that the location estimation is sufficiently accurate.

Abstract: Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

Abstract: A communication system and method include a group of multiple, discrete communication devices, each including an isotropic antenna element and a controller. A role of a first communication device is master device, and the role of the other communication devices is follower device. The controller of the master device determines relative locations of the follower devices to the master device, and assigns different phase delay values to the communication devices based on the relative locations. The controller of the master device communicates message information including the phase delay values, a message payload, and a transmit time to the follower devices for the isotropic antenna elements of the communication devices to collectively form an antenna array that transmits the message payload at the transmit time. The antenna array transmits the message payload with a phase taper defined by the phase delay values to form a beam towards a target.

Abstract: Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

Abstract: In examples, systems and methods for a radiating system of an aircraft are described. The aircraft system includes a conformal antenna array having a flexible substrate configured to conform to a curvature of a portion of an aircraft. Additionally, the conformal array has a plurality of antenna elements coupled to a first surface of the flexible substrate, where the plurality of antennas are formed in an array. The aircraft system further includes radio front-end hardware configured to communicate signals to and from the plurality of antenna elements. Moreover, the aircraft system includes a radar processing system coupled to the radio front-end hardware. Yet further, the aircraft system includes a renewable energy source configured to power the radar processing system and the radio front-end hardware.

Abstract: In examples, systems and methods for a conformal array are described. In one example, an array is described. The array includes a plurality of antenna elements formed in a conformal array. The conformal array is arranged on a non-planar surface. Additionally, the array includes a respective feed for each of at least a subset of the antennas of the plurality of antenna elements. Each feed of the array is coupled to a respective antenna of the plurality of antennas based on a taper profile determined based on the non-planar surface. In another example, a method of determining an antenna array is disclosed. The method includes determining a planar array configuration for a plurality of antennas. The method further includes mapping the planar array configuration to a conformal surface to form a conformal array. Additionally, the method includes determining a taper profile based on the conformal array.

Abstract: In examples, systems and methods for a radiating system of an aircraft are described. The aircraft system includes a conformal antenna array having a flexible substrate configured to conform to a curvature of a portion of an aircraft. Additionally, the conformal array has a plurality of antenna elements coupled to a first surface of the flexible substrate, where the plurality of antennas are formed in an array. The aircraft system further includes radio front-end hardware configured to communicate signals to and from the plurality of antenna elements. Moreover, the aircraft system includes a radar processing system coupled to the radio front-end hardware. Yet further, the aircraft system includes a renewable energy source configured to power the radar processing system and the radio front-end hardware.

Abstract: Systems, apparatuses and methods may provide for label technology that includes a flexible substrate and a flexible circuit coupled to the flexible substrate, the flexible circuit including a power source, a microcontroller, a plurality of sensors, one or more transceivers, and an antenna. The microcontroller may be configured to identify sensor readings in one or more signals from the plurality of sensors and send the sensor readings to one or more of a central computer or a computer network via one or more standard wireless transmission protocols, wherein at least one of the sensor readings is sent in a push communication.

Abstract: Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: In examples, systems and methods for a conformal array are described. In one example, an array is described. The array includes a plurality of antenna elements formed in a conformal array. The conformal array is arranged on a non-planar surface. Additionally, the array includes a respective feed for each of at least a subset of the antennas of the plurality of antenna elements. Each feed of the array is coupled to a respective antenna of the plurality of antennas based on a taper profile determined based on the non-planar surface. In another example, a method of determining an antenna array is disclosed. The method includes determining a planar array configuration for a plurality of antennas. The method further includes mapping the planar array configuration to a conformal surface to form a conformal array. Additionally, the method includes determining a taper profile based on the conformal array.

Abstract: A broadband conformal antenna (“BCA”) is disclosed. The BCA includes a narrow approximately rectangular outer conductive (“NARO”) housing, a plurality of dielectric layers within the NARO housing forming a laminated dielectric structure, and an inner conductor formed within the laminated dielectric structure. The NARO housing includes a top broad wall and the BCA further includes an antenna slot within the top broad wall. The BCA is configured to support a transverse electromagnetic signal within the NARO housing.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: A cooling device for an electromagnetic interference filter is disclosed. The cooling device includes a housing. The housing includes a main body having a cavity shaped to receive the electromagnetic interference filter and one or more cooling channels surrounding at least a portion of the cavity in the main body of the housing. The one or more cooling channels define one or more flow paths that are contained completely within the housing. The housing also includes an inlet port and an outlet port. The one or more cooling channels fluidly connect the inlet port to the outlet port, and a cooling medium is configured to flow into the inlet port, through the one or more cooling channels, and exit the housing through the outlet port.

Abstract: A device includes a plurality of electromagnetically bi-anisotropic devices, a conductive layer, and a spacer layer disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The device also includes an electromagnetic interface device disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The electromagnetic interface device is configured to output an electrical signal responsive to receipt of an electromagnetic wave.

Abstract: A honeycomb thermal insulation structure may comprise a first facesheet, a second facesheet, and a honeycomb core between the first facesheet and the second facesheet. The honeycomb core may include a plurality of honeycomb unit cells each composed of walls having a height and spaced by a distance. The walls of the honeycomb cells may have perforations. The honeycomb thermal insulation structure may further comprise a non-convective gas loaded in the honeycomb unit cells between the walls. A flow of the gas through the perforations may be substantially absent.

Abstract: A real time inspection and correction system and method for additive manufacturing process is described. The method may include operating a direct writing device configured to deposit material on a substrate through a tip to provide a portion of a product according to initial parameter values, receiving a hyperspectral image frame including a plurality of spectral images of the deposited material, processing the received hyperspectral image frame to determine a characteristic of the deposited material comparing the determined characteristic with a target characteristic determining at least one corrective parameter value to conform the determined characteristic to the target characteristic updating at least one of the initial parameter values with the corrective parameter values, and operating the direct writing device to deposit additional material on the substrate according to the corrective parameter value.

Abstract: Provided is a low-weight, high-efficiency inductor design for use with or in electrical power equipment, such as inverters. A toroidal power inductor includes a support structure comprising an outer shell, an inner shell, and one or more coolant channels formed therebetween, a plurality of conductors wrapped around and supported by an exterior surface of the outer shell, and an interior cavity substantially enclosed by the inner shell of the toroidal support structure. The plurality of conductors are configured to provide an inductance for the toroidal power inductor, and the one or more coolant channels are distributed beneath the exterior surface of the outer shell to cool the plurality of conductors. An air-core power inductor may implement the conductors using high-temperature superconducting (HTS) tapes cooled by cryogenic fluid flowing within the coolant channels.

Abstract: A device includes a plurality of electromagnetically bi-anisotropic devices, a conductive layer, and a spacer layer disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The device also includes an electromagnetic interface device disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The electromagnetic interface device is configured to output an electrical signal responsive to receipt of an electromagnetic wave.

Abstract: Provided is a cooling device, and methods of fabricating and operating such cooling devices, for electromagnetic induction (EMI) filters. Specifically, a cooling device is provided which comprises a housing enclosing the electromagnetic induction filter. The housing may comprise one or more of the following: one or more exterior chambers, one or more central flow channels, and peripheral flow channels. The one or more exterior chambers surround an exterior surface of the EMI filter. The one or more central flow channels extend the length of the center of the EMIR filter. The peripheral flow channels extend the length of the exterior of the electromagnetic induction filter. The peripheral flow channels may be disposed between one or more exterior chambers and open into the one or more exterior chambers. The one or more central flow channels, the peripheral flow channels, and the one or more exterior chambers are interconnected.