Patents by Inventor John Dolaz

John Dolaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic component support with reinforced structure
    Patent number: 8586870
    Abstract: A microelectronic support assembly has a support member formed from plateable resin, such as liquid crystalline polymer and the support member is configured with a laser to define holes in the support member. These holes and other areas of the support member are plated and the plating forms a plurality of hollow metal columns that provide reinforcement to the support member so that it can resist wire bonding pressures.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: November 19, 2013
    Assignee: Molex Incorporated
    Inventors: Kirk B. Peloza, John Dolaz
  • Three-dimensional plated support frame
    Patent number: 7815475
    Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: October 19, 2010
    Assignee: Molex Incorporated
    Inventors: Kirk B. Peloza, Victor Zaderej, John Dolaz, Stephen Rushing
  • MICROELECTRONIC COMPONENT SUPPORT WITH REINFORCED STRUCTURE
    Publication number: 20100243844
    Abstract: A microelectronic support assembly has a support member formed from plateable resin, such as liquid crystalline polymer and the support member is configured with a laser to define holes in the support member. These holes and other areas of the support member are plated and the plating forms a plurality of hollow metal columns that provide reinforcement to the support member so that it can resist wire bonding pressures.
    Type: Application
    Filed: March 26, 2010
    Publication date: September 30, 2010
    Applicant: Molex Incorporated
    Inventors: Kirk B. Peloza, John Dolaz
  • PLATED DIELECTRIC FRAME WITH INTEGRATED CONNECTOR
    Publication number: 20090163045
    Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 25, 2009
    Applicant: Molex Incorporated
    Inventors: Kirk B. Peloza, Victor Zaderej, John Dolaz, Stephen Rushing