Patents by Inventor John E. Daugherty
John E. Daugherty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11662237Abstract: A fluid delivery system includes N first valves. Inlets of the N first valves are fluidly connected to N gas sources, respectively, where N is an integer greater than zero. N mass flow controllers include a microelectromechanical (MEMS) Coriolis flow sensor having an inlet in fluid communication with an outlet of a corresponding one of the N first valves. A second valve has an inlet in fluid communication with an outlet of the MEMS Coriolis flow sensor and an outlet supplying fluid to treat a substrate arranged in a processing chamber. A controller in communication with the MEMS Coriolis flow sensor is configured to determine at least one of a mass flow rate and a density of fluid flowing through the MEMS Coriolis flow sensor.Type: GrantFiled: April 2, 2019Date of Patent: May 30, 2023Assignee: LAM RESEARCH CORPORATIONInventors: Iqbal A. Shareef, Dennis Smith, John E. Daugherty
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Patent number: 11393705Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: GrantFiled: September 18, 2020Date of Patent: July 19, 2022Assignee: Lam Research CorporationInventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Publication number: 20220013388Abstract: Various embodiments include apparatuses to provides an in-situ, non-intrusive verification of substrate pin-lifters while a substrate is in a substrate-processing location on a process tool. The disclosed subject matter can also verify any unexpected substrate movement prior to or while the substrate is being removed from the process tool. In an exemplary embodiment, a pin-lifter test substrate includes a number of motion sensors and at least one force sensor. The motion sensors including at least one type of sensor selected from sensor types including inclinometers and accelerometers. A memory device on the pin-lifter test substrate records data received from the motion sensors. Instead of or in addition to the memory device, a wireless communications device transmits data received from the motion sensors to a remote receiver. Other apparatuses and systems are disclosed.Type: ApplicationFiled: December 3, 2018Publication date: January 13, 2022Inventors: John E. Daugherty, Changyou Jing, Sushil Anand
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Publication number: 20210343510Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Inventors: Lin Xu, Robin Koshy, John E. Daugherty, Satish Srinivasan, David Wetzel
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Patent number: 11087961Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.Type: GrantFiled: March 2, 2018Date of Patent: August 10, 2021Assignee: LAM RESEARCH CORPORATIONInventors: Lin Xu, Robin Koshy, John E. Daugherty, Satish Srinivasan, David Wetzel
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Publication number: 20210140807Abstract: A fluid delivery system includes N first valves. Inlets of the N first valves are fluidly connected to N gas sources, respectively, where N is an integer greater than zero. N mass flow controllers include a microelectromechanical (MEMS) Coriolis flow sensor having an inlet in fluid communication with an outlet of a corresponding one of the N first valves. A second valve has an inlet in fluid communication with an outlet of the MEMS Coriolis flow sensor and an outlet supplying fluid to treat a substrate arranged in a processing chamber. A controller in communication with the MEMS Coriolis flow sensor is configured to determine at least one of a mass flow rate and a density of fluid flowing through the MEMS Coriolis flow sensor.Type: ApplicationFiled: April 2, 2019Publication date: May 13, 2021Inventors: Iqbal A. SHAREEF, Dennis SMITH, John E. DAUGHERTY
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Publication number: 20210005485Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: ApplicationFiled: September 18, 2020Publication date: January 7, 2021Inventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Patent number: 10557197Abstract: A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.Type: GrantFiled: October 15, 2015Date of Patent: February 11, 2020Assignee: Lam Research CorporationInventors: Andrew C. Lee, Michael C. Kellogg, Christopher J. Pena, John E. Daugherty
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Publication number: 20190272981Abstract: A quartz structure includes a protective layer comprising yttrium oxide. The quartz structure may be fabricated by: (a) receiving a quartz structure; and (b) coating the quartz structure with a protective layer comprising yttrium oxide to form a part to be used in the plasma reactor. The part has a size and shape adapted for forming a window or injector in a plasma reactor. The protective layer does not substantially change the size or shape of the quartz structure. The part may be installed in the plasma reactor at a location where, during operation, a plasma will contact or be proximate to the part.Type: ApplicationFiled: March 2, 2018Publication date: September 5, 2019Inventors: Lin Xu, Robin Koshy, John E. Daugherty, Satish Srinivasan, David Wetzel
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Publication number: 20160111257Abstract: A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus. The substrate includes a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate includes a first gas channel extending into an interior major surface that at least partially overlaps a second gas channel extending into a different interior major surface. The substrate includes a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the forth gas supply component.Type: ApplicationFiled: October 17, 2014Publication date: April 21, 2016Inventors: Michael C. Kellogg, Christopher J. Pena, John E. Daugherty
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Publication number: 20160108523Abstract: A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.Type: ApplicationFiled: October 15, 2015Publication date: April 21, 2016Inventors: Andrew C. Lee, Michael C. Kellogg, Christopher J. Pena, John E. Daugherty
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Patent number: 9314854Abstract: A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 ?m.Type: GrantFiled: January 30, 2013Date of Patent: April 19, 2016Assignee: LAM RESEARCH CORPORATIONInventors: Lihua Li Huang, Duane D. Scott, Joseph P. Doench, Jamie Burns, Emily P. Stenta, Gregory R. Bettencourt, John E. Daugherty
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Publication number: 20140213061Abstract: A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 ?m.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: LAM RESEARCH CORPORATIONInventors: Lihua Li Huang, Duane D. Scott, Joseph P. Doench, Jamie Burns, Emily P. Stenta, Gregory R. Bettencourt, John E. Daugherty
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Patent number: 8486841Abstract: A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.Type: GrantFiled: September 14, 2009Date of Patent: July 16, 2013Assignee: Lam Research CorporationInventors: Robert J. O'Donnell, Christopher C. Chang, John E. Daugherty
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Patent number: 8318035Abstract: Methods of surface finishing a component useful for a plasma processing apparatus are provided. The component includes at least one plasma-exposed quartz glass surface. The method includes mechanically polishing, chemically etching and cleaning the plasma-exposed surface to achieve a desired surface morphology. Quartz glass sealing surfaces of the component also can be finished by the methods. Plasma-exposed surface and sealing surfaces of the same component can be finished to different surface morphologies from each other.Type: GrantFiled: June 22, 2007Date of Patent: November 27, 2012Assignee: Lam Research CorporationInventors: Mark W. Kiehlbauch, John E. Daugherty
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Patent number: 8292698Abstract: An on-line method of cleaning contaminants from at least one interior surface in plasma chambers comprises blasting one or more interior surfaces of a plasma chamber with dry ice to remove contaminants from the one or more surfaces.Type: GrantFiled: March 30, 2007Date of Patent: October 23, 2012Assignee: Lam Research CorporationInventors: Hong Shih, Oana M. Leonte, John E. Daugherty, Tuochuan Huang, Gregory J. Goldspring, Michael C. May
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Patent number: 7685965Abstract: A port provides access to a process chamber interior for exemplary gas injection and process analysis and measurement. Centering the port in an external RF coil reduces the strength of an electric field across the port in generating plasma in the chamber. Plasma-induced etching and deposition in a bore of a gas injection injector mounted in the port is reduced by a grounded shield surrounding a region defined by the port, extending the life of the injector and of a chamber window in which the port is provided. The shield surrounds the region, and is configured with a longitudinally-extending slot defining a retainer arm and a flexure junction, and with a retainer foot on the arm. The junction urges the arm to extend the foot into a retainer groove of the port, and flexes to permit foot movement out of the groove in removal of the shield from the port.Type: GrantFiled: January 26, 2006Date of Patent: March 30, 2010Assignee: Lam Research CorporationInventors: Fangli J. Hao, John E. Daugherty, Allan K. Ronne
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Publication number: 20100003826Abstract: A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.Type: ApplicationFiled: September 14, 2009Publication date: January 7, 2010Applicant: Lam Research CorporationInventors: ROBERT J. O'DONNELL, Christopher C. Chang, John E. Daugherty
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Patent number: 7605086Abstract: A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.Type: GrantFiled: September 22, 2006Date of Patent: October 20, 2009Assignee: Lam Research CorporationInventors: Robert J. O'Donnell, Christopher C. Chang, John E. Daugherty
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Patent number: 7578889Abstract: Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.Type: GrantFiled: March 30, 2007Date of Patent: August 25, 2009Assignee: Lam Research CorporationInventors: Hong Shih, Yaobo Yin, Shun Jackson Wu, Armen Avoyan, John E. Daugherty, Linda Jiang