Patents by Inventor John E. Larking

John E. Larking has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrangement for high frequency application
    Patent number: 7579697
    Abstract: A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: August 25, 2009
    Assignee: International Rectifier Corporation
    Inventor: John E. Larking
  • Arrangement for high frequency application
    Publication number: 20080246127
    Abstract: A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
    Type: Application
    Filed: June 10, 2008
    Publication date: October 9, 2008
    Inventor: John E. Larking
  • Direct FET device for high frequency application
    Patent number: 7397137
    Abstract: A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: July 8, 2008
    Assignee: International Rectifier Corporation
    Inventor: John E. Larking
  • Direct fet device for high frequency application
    Patent number: 7119447
    Abstract: A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: October 10, 2006
    Assignee: International Rectifier Corporation
    Inventor: John E. Larking
  • Direct fet device for high frequency application
    Publication number: 20040104489
    Abstract: A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
    Type: Application
    Filed: July 15, 2003
    Publication date: June 3, 2004
    Applicant: International Rectifier Corporation
    Inventor: John E. Larking