Patents by Inventor John Earnshaw

John Earnshaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9385242
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 5, 2016
    Assignee: Diodes Incorporated
    Inventors: John Earnshaw, Wolfgang Kemper, Yen-Li Lin, Steve Badcock, Mark French
  • Publication number: 20150206985
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Application
    Filed: March 30, 2015
    Publication date: July 23, 2015
    Applicant: DIODES INCORPORATED
    Inventors: John Earnshaw, Wolfgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Patent number: 9048106
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: June 2, 2015
    Assignee: Diodes Incorporated
    Inventors: John Earnshaw, Wofgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Publication number: 20140167204
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: DIODES INCORPORATED
    Inventors: John Earnshaw, Wofgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Publication number: 20070209688
    Abstract: A clamp 10 for holding two elongate members 23a, 23b so that they extend at a preset angle from each other, comprising: two clamp portions 12, 14 each having co-operating engaging surfaces 16a, 16b, each clamp portion having an axial bore 18a, 18b extending perpendicularly to the engaging surfaces and a receiving portion for holding one of the elongate members; a stem or rod 19, passing through the bore of the clamp portions and attached at one end to a lever or handle 20 for rotating the stem in the bore, and a cam acting between the stem and at least one of the clamp portions so that the clamp portions can be moved from a position in which the engaging surfaces are not engaged to a position in which the engaging surfaces co-operatively engage by rotating the lever by approximately 90°.
    Type: Application
    Filed: December 20, 2004
    Publication date: September 13, 2007
    Applicant: HOYLAND FOX LIMITED
    Inventor: John Earnshaw
  • Patent number: 4992917
    Abstract: A light reflector includes a plurality of opaque, generally triangular panels connected together to form a three dimensional geometric figure surrounding an inside space. Each panel has a reflective surface facing the inside space and each corner of each of the panels is adjacent a corner of an adjacent panel. The panels are spaced apart from each other by rectangular, open areas. An artifical light source is placed inside the inside space. The reflective surfaces relect light from the artificial light source and direct reflected light toward the rectangular open areas. Plants are situated adjacent the rectangular open areas and receive light emanating therefrom.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: February 12, 1991
    Inventor: John Earnshaw
  • Patent number: D755667
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: May 10, 2016
    Assignee: DUBADECA HOLDINGS LTD.
    Inventor: John Earnshaw