Abstract: A method for transient analysis of a memory module circuit, the method including: determining port to port resistances between terminals of internal circuits of a plurality of leaf cells of a netlist representing the memory module circuit; generating a plurality of equivalent networks corresponding to the internal circuits of the leaf cells, the equivalent networks being connected to each other; promoting the equivalent networks of the leaf cells to a hierarchical level above the leaf cells in the netlist representing the memory module circuit; shorting one or more terminals of each of the leaf cells to a central node of a corresponding one of the equivalent networks; and performing the transient analysis of the leaf cells of the netlist representing the memory module circuit.

Abstract: A memory bypass circuit for a memory device comprises: a word line disable circuit; a read and write activation circuit; an internal clock generator; and a write data input circuit. The word line disable circuit is coupled to a word line of the memory device for disabling a write function to the word line. The read and write activation circuit is coupled to the memory device for reading and writing of input data. The internal clock generator is coupled to the word line disable circuit and the read/write activation circuit. The write data input circuit is coupled to a write driver of the memory device for providing write data.

Abstract: A memory bypass circuit for a memory device comprises: a word line disable circuit; a read and write activation circuit; an internal clock generator; and a write data input circuit. The word line disable circuit is coupled to a word line of the memory device for disabling a write function to the word line. The read and write activation circuit is coupled to the memory device for reading and writing of input data. The internal clock generator is coupled to the word line disable circuit and the read/write activation circuit. The write data input circuit is coupled to a write driver of the memory device for providing write data.

Abstract: An integrated level-shifter and memory clock is disclosed that minimizes delay of voltage level-shifting from an external clock on a first logic supply voltage to an internal clock on a higher array supply voltage that is pulse-width independent of the external clock used to generate the internal clock. The generation of the internal clock on the higher array supply voltages is accomplished in two stages of logic. An array-tracking timing delay circuit mimics access delay to generate a MRST_P to reset the internal clock on the higher array supply voltage.

Abstract: A memory bypass circuit for a memory device comprises: a word line disable circuit; a read and write activation circuit; an internal clock generator; and a write data input circuit. The word line disable circuit is coupled to a word line of the memory device for disabling a write function to the word line. The read and write activation circuit is coupled to the memory device for reading and writing of input data. The internal clock generator is coupled to the word line disable circuit and the read/write activation circuit. The write data input circuit is coupled to a write driver of the memory device for providing write data.

Abstract: A memory bypass circuit for a memory device comprises: a word line disable circuit; a read and write activation circuit; an internal clock generator; and a write data input circuit. The word line disable circuit is coupled to a word line of the memory device for disabling a write function to the word line. The read and write activation circuit is coupled to the memory device for reading and writing of input data. The internal clock generator is coupled to the word line disable circuit and the read/write activation circuit. The write data input circuit is coupled to a write driver of the memory device for providing write data.

Abstract: A sense amplifier for sensing a line of a semiconductor device comprises a p-channel pull-up transistor for charging the line, an inverter, and a pull-up controller. The p-channel pull-up transistor and the inverter are coupled to the line. The inverter inverts a line voltage of the line. The pull-up controller is coupled to the gate of the p-channel pull-up transistor and operates the p-channel pull-up transistor as a function of the inverted line voltage.

Abstract: A content addressable memory (“CAM”) field enabling logic comprises fields and field enable logics. The fields each have local match lines and a corresponding field enable control for enabling the respective field. The field enable logics are serially connected. Each of the fields is coupled to a corresponding one of the field enable logics via the respective local match lines. The corresponding field enable control for each of the fields is coupled to the corresponding one of the field enable logic and to any ones of the field enable logics that come after the corresponding one of the field enable logic along the serially-connected field enable logics.

Abstract: A single ended line sense amplifier having an input coupled to a single ended line having a near end and a far end device comprises a plurality of nFET stacks coupled between the near end of the single ended line and the far end of the single ended line, a single ended line comparator coupled to the near end of the single ended line configured to compare a voltage at the near end of the single ended line to provide a logic state output, and a charge transistor coupled to the single ended line at a point that is between the near end of the single ended line and the far end of the single ended line to shift occurrence of snap back from strong charging of the single ended line.

Abstract: A line sense amplifier comprises: a presearch block, a main search block, and a timing circuit. The presearch block is coupled to a presearch line for sensing the presearch line. The main search block is coupled to a main line for sensing the main line. The timing circuit operates the presearch block and the main search block for charging and sensing of the presearch line and the main line. The timing circuit initiates the main search block to determine a match condition for the main line based on whether a match condition is determined for the presearch line.

Abstract: A single ended line sense amplifier having an input coupled to a single ended line having a near end and a far end device comprises a plurality of nFET stacks coupled between the near end of the single ended line and the far end of the single ended line, a single ended line comparator coupled to the near end of the single ended line configured to compare a voltage at the near end of the single ended line to provide a logic state output, and a charge transistor coupled to the single ended line at a point that is between the near end of the single ended line and the far end of the single ended line to shift occurrence of snap back from strong charging of the single ended line.

Abstract: A line sense amplifier comprises: a presearch block, a main search block, and a timing circuit. The presearch block is coupled to a presearch line for sensing the presearch line. The main search block is coupled to a main line for sensing the main line. The timing circuit operates the presearch block and the main search block for charging and sensing of the presearch line and the main line. The timing circuit initiates the main search block to determine a match condition for the main line based on whether a match condition is determined for the presearch line.

Abstract: A sense amplifier for sensing a line of a semiconductor device comprises a p-channel pull-up transistor for charging the line, an inverter, and a pull-up controller. The p-channel pull-up transistor and the inverter are coupled to the line. The inverter inverts a line voltage of the line. The pull-up controller is coupled to the gate of the p-channel pull-up transistor and operates the p-channel pull-up transistor as a function of the inverted line voltage.

Abstract: A word line driver circuit coupled to a memory circuit word line includes pull-up, pull-up clamp, pull-down and pull-down clamp transistors, each having a source, a drain and a gate. For the pull-up transistor, the source is coupled to a first power supply, and the gate to a pull-up control signal. For the pull-up clamp transistor, the source is coupled to the drain of the pull-up transistor, the drain to the word line, and the gate to a pull-up clamp gate signal. For the pull-down transistor, the source is coupled to a second power supply, and the gate to a pull-down control signal. For the pull-down clamp transistor, the source is coupled to the drain of the pull-down transistor, the drain to the word line, and the gate to a pull-down clamp gate signal. The word line is coupled to one or more DRAM cells. Source to drain voltage magnitudes of the pull-up and pull-down transistors are less than a voltage between the first and second power supplies.

Abstract: A word line driver circuit coupled to a memory circuit word line includes pull-up, pull-up clamp, pull-down and pull-down clamp transistors, each having a source, a drain and a gate. For the pull-up transistor, the source is coupled to a first power supply, and the gate to a pull-up control signal. For the pull-up clamp transistor, the source is coupled to the drain of the pull-up transistor, the drain to the word line, and the gate to a pull-up clamp gate signal. For the pull-down transistor, the source is coupled to a second power supply, and the gate to a pull-down control signal. For the pull-down clamp transistor, the source is coupled to the drain of the pull-down transistor, the drain to the word line, and the gate to a pull-down clamp gate signal. The word line is coupled to one or more DRAM cells. Source to drain voltage magnitudes of the pull-up and pull-down transistors are less than a voltage between the first and second power supplies.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.

Abstract: A design structure for implementing redundancy programming in a memory macro of an integrated circuit chip. It is assumed that all fails are row fails until determined to be bitline fails, circuits for implementing a method wherein it is assumed that all fails are row fails until determined to be bitline fails and test patterns are passed back to the failure detecting circuit when a wordline destination of the test patterns has previously been determined to be failing, and the test patterns and resultant patterns are passed between the memory macro and a test engine via logic paths connecting the memory macro to other circuits in said integrated circuit chip.

Abstract: Techniques for sensing data states of respective memory cells in a memory array are provided, the memory array including at least a first bit line coupled to at least a subset of the memory cells. In one aspect, a circuit for sensing data states of respective memory cells in the memory array includes at least one sense amplifier coupled to the first bit line. The sense amplifier includes a first transistor operative to selectively inhibit charging of the first bit line in a manner which is independent of a voltage level on a second bit line coupled to the sense amplifier.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.

Abstract: Techniques for sensing data states of respective memory cells in a memory array are provided, the memory array including at least a first bit line coupled to at least a subset of the memory cells. In one aspect, a circuit for sensing data states of respective memory cells in the memory array includes at least one sense amplifier coupled to the first bit line. The sense amplifier includes a first transistor operative to selectively inhibit charging of the first bit line in a manner which is independent of a voltage level on a second bit line coupled to the sense amplifier.