Patents by Inventor John Ettlinger

John Ettlinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making unreacted metal/aluminum sputter target
    Patent number: 6010583
    Abstract: A high performance, high density sputtering target and a method of making. An aluminum and non-aluminum reactive metal powder blend is subjected to cold pressing under pressure, machining, evacuating, and hot pressing under pressure. The aluminum and non-aluminum metal react directly to yield a high performance, high density sputter target containing greater than about 2% aluminum with substantially uniform composition across the body.
    Type: Grant
    Filed: September 9, 1997
    Date of Patent: January 4, 2000
    Assignees: Sony Corporation, Materials Research Corporation
    Inventors: Suresh Annavarapu, John Ettlinger, Tony Sica