Abstract: A system including the method and apparatus for encapsulating electric wire splices wherein a plurality of electrical conductors in substantially aligned opposed relationship are electrically spliced and an encapsulation mass of thermoplastic dielectric material forms an insulative jacket over the splice. Encapsulation is produced by coating the spliced conductors with a liquified hot melt sealant, agitating and projecting the sealant toward the splice to fill small interstices between the conductors, removing the coated splice and conductors from the liquid sealant and drying the sealant into a dielectric jacket surrounding the splice.