Abstract: A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto.

Abstract: A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto.

Abstract: A probe test head for a high density pin count integrated circuit, includes: a flexible membrane; an array of conductive structures, each one of the structures including a mechanically compliant probe tip affixed to the membrane, such that an attachment point enables mechanical actuation of the probe tip through a conductive member parallel to the membrane. A method for fabrication and measurement apparatus are provided.

Abstract: A probe test head for a high density pin count integrated circuit, includes: a flexible membrane; an array of conductive structures, each one of the structures including a mechanically compliant probe tip affixed to the membrane, such that an attachment point enables mechanical actuation of the probe tip through a conductive member parallel to the membrane. A method for fabrication and measurement apparatus are provided.

Abstract: A method and apparatus for testing, the apparatus including: a probe array mounted on an inner portion of a gimbaled bearing, the inner portion of the gimbaled bearing having a spherical surface defined by a surface of a first sphere between two parallel small circles of the first sphere, a radius of the first sphere centered on a point on a top surface of the probe array; and an outer portion of the gimbaled bearing, the outer portion of the gimbaled bearing having a spherical surface defined by the surface of a second sphere between two parallel small circles of the second sphere, a radius of the second sphere centered on the point on the top surface of the probe array.

Abstract: A space transformer including a body; a ground conductor within the body; a power conductor within the body, the power conductor adapted to be at a higher voltage level than a voltage level of the ground conductor; and one or more decoupling capacitors physically located within the body and electrically connected between the ground conductor and the power conductor.

Abstract: A method and system for testing wafers, and particularly a wafer test system employing probes to provide for electrical contact with a device under test (DUT) which is located on a wafer. More particularly, also provided is a method and system for implementing wafer tests where the probes first contact a simulated wafer which incorporates an array of spaced load cells to determine the optimum probe overdrive. The DUT is then tested at the optimum overdrive.