Patents by Inventor John Farah
John Farah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11914025Abstract: A plurality of positional sensing devices are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. Phase shift of modulated Doppler pulses reflected from the sensing devices to objects are measured and converted into positional data indicating positions of detected objects within the environment. Associated timestamp data is also collected by the positional sensing devices. The positional data and associated timestamp data is aggregated from the plurality of positional sensors, and the aggregated positional data and is clustered to determine point clouds which are associated with the detected objects. The clusters are tracked by tracklets that track the position of each cluster over time. Trajectories for each detected object are determined by connecting tracklets together that are associated with the same detected object.Type: GrantFiled: August 4, 2023Date of Patent: February 27, 2024Assignee: Density, Inc.Inventors: Andrew Farah, Casey Kelso, Christian Ayerh, John Shanley, Robert Grazioli, Benjamin Redfield, Garrett Bastable, Brian Weinreich, Kyle Hay
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Patent number: 10644188Abstract: An epitaxially grown III-V layer is separated from the growth substrate. The III-V layer can be an inverted lattice matched (ILM) or inverted metamorphic (IMM) solar cell, or a light emitting diode (LED). A sacrificial epitaxial layer is embedded between the GaAs wafer and the III-V layer. The sacrificial layer is damaged by absorbing IR laser radiation. A Nd:YAG laser is chosen with the right wavelength, pulse width and power. The radiation is not absorbed by either the GaAs wafer or the III-V layer. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The III-V layer is detached from the growth wafer by propagating a crack through the damaged layer. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new III-V layers, resulting in savings in raw materials and grinding and etching costs.Type: GrantFiled: November 17, 2017Date of Patent: May 5, 2020Inventor: John Farah
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Publication number: 20190271534Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light. A method of measuring the angular spectrum I(?x,?y) of an object, i.e. the intensity of the wavefront vs angle of incidence.Type: ApplicationFiled: May 3, 2019Publication date: September 5, 2019Inventor: John Farah
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Patent number: 10281258Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light. A method of measuring the angular spectrum I(?x,?y) of an object, i.e. the intensity of the wavefront vs angle of incidence.Type: GrantFiled: May 31, 2016Date of Patent: May 7, 2019Inventor: John Farah
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Publication number: 20180248070Abstract: An epitaxially grown III-V layer is separated from the growth substrate. The III-V layer can be an inverted lattice matched (ILM) or inverted metamorphic (IMM) solar cell, or a light emitting diode (LED). A sacrificial epitaxial layer is embedded between the GaAs wafer and the III-V layer. The sacrificial layer is damaged by absorbing IR laser radiation. A Nd:YAG laser is chosen with the right wavelength, pulse width and power. The radiation is not absorbed by either the GaAs wafer or the III-V layer. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The III-V layer is detached from the growth wafer by propagating a crack through the damaged layer. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new III-V layers, resulting in savings in raw materials and grinding and etching costs.Type: ApplicationFiled: November 17, 2017Publication date: August 30, 2018Inventor: John Farah
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Patent number: 9831363Abstract: An epitaxially grown III-V layer is separated from the growth substrate. The III-V layer can be an inverted lattice matched (ILM) or inverted metamorphic (IMM) solar cell, or a light emitting diode (LED). A sacrificial epitaxial layer is embedded between the GaAs wafer and the III-V layer. The sacrificial layer is damaged by absorbing IR laser radiation. A laser is chosen with the right wavelength, pulse width and power. The radiation is not absorbed by either the GaAs wafer or the III-V layer. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The III-V layer is detached from the growth wafer by propagating a crack through the damaged layer. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new III-V layers, resulting in savings in raw materials and grinding and etching costs.Type: GrantFiled: June 19, 2014Date of Patent: November 28, 2017Inventor: John Farah
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Publication number: 20160305773Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light. A method of measuring the angular spectrum I(?x,?y) of an object, i.e. the intensity of the wavefront vs angle of incidence.Type: ApplicationFiled: May 31, 2016Publication date: October 20, 2016Inventor: John Farah
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Patent number: 9354037Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: GrantFiled: April 4, 2014Date of Patent: May 31, 2016Inventor: John Farah
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Publication number: 20150368833Abstract: An epitaxially grown layer III-V solar cell is separated from the growth substrate. A sacrificial epitaxial layer is embedded between the GaAs wafer and the solar cell. The sacrificial layer is damaged by absorbing IR laser radiation. A laser is chosen with the right wavelength, pulse width and power. The radiation is not absorbed by either the GaAs wafer or the solar cell. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The solar cell is detached from the growth wafer by propagating a crack through the damaged layer. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new cells, resulting in savings in raw materials and grinding and etching costs amounting to up to 30% of the cost of the cell. Several cells are integrated on a common blanket polyimide sheet and interconnected by copper plating.Type: ApplicationFiled: June 19, 2014Publication date: December 24, 2015Inventor: John Farah
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Publication number: 20150258769Abstract: An epitaxially grown layer III-V solar cell is separated from the growth substrate by propagating a crack close to the epi/wafer interface. The crack is driven by the elastic strain energy built up due to thermal stresses between GaAs and polyimide by cooling below room temperature. A GaAs wafer is bonded to a polyimide substrate on the epi-side and scribed on the opposite side. The crack is initiated from the scratch and guided along the interface using an epitaxially grown sacrificial layer with lower fracture toughness under the solar cell. No expensive ion implantation or lateral chemical etching of a sacrificial layer is needed. The active layer is transferred wafer-scale to inexpensive, flexible, organic substrate. The process allows re-using of the wafer to grow new cells, resulting in savings in raw materials and grinding and etching costs amounting to up to 30% of the cost of the cell. Several cells are integrated on a common blanket polyimide sheet and interconnected by copper plating.Type: ApplicationFiled: February 5, 2015Publication date: September 17, 2015Inventor: John Farah
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Publication number: 20140268162Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: ApplicationFiled: April 4, 2014Publication date: September 18, 2014Inventor: John Farah
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Patent number: 8693001Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: GrantFiled: February 11, 2013Date of Patent: April 8, 2014Inventor: John Farah
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Publication number: 20130222814Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: ApplicationFiled: February 11, 2013Publication date: August 29, 2013Inventor: John Farah
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Patent number: 8379214Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: GrantFiled: March 2, 2009Date of Patent: February 19, 2013Inventor: John Farah
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Patent number: 8107777Abstract: Polyimide substrates are bonded to germanium wafers having an epitaxially grown III-V layer and a metal layer. The polyimide substrate and the Ge, wafer are subsequently thinned by grinding and etching to reach a final thickness of 25 ?ms Ge on 25 ?ms adhesive layer on 50 ?ms polyimide substrate. The choice of adhesive is of paramount importance. There are several requirements for the adhesive layer to act as a permanent carrier of the thin fragile multi junction solar cell. The adhesive must remain flexible after curing and have a low CTE. The use of an adhesive that cures without the addition of heat, preferably at room temperature. Furthermore, the adhesive layer has a uniform thickness preferably less than 25 ums (1 mil) and be void-free. A clear adhesive which does not contain any particles in order to obtain a smooth uniform void-free bond line. However, clear adhesives have CTE's that are larger than 80 ppm/°C. and which can be as high as 200 ppm/°C. or more above the glass transition temperature.Type: GrantFiled: April 2, 2009Date of Patent: January 31, 2012Inventor: John Farah
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Publication number: 20100035052Abstract: Polyimide substrates are bonded to germanium wafers having an epitaxially grown III-V layer and a metal layer. The polyimide substrate and the Ge wafer are subsequently thinned by grinding and etching to reach a final thickness of 25 ?ms Ge on 25 ?ms adhesive layer on 50 ?ms polyimide substrate. The choice of adhesive is of paramount importance. There are several requirements for the adhesive layer to act as a permanent carrier of the thin fragile multijunction solar cell. The adhesive must remain flexible after curing and have a low CTE. It is desired to use an adhesive that cures without the addition of heat, preferably at room temperature. Furthermore, the adhesive layer should have a uniform thickness preferably less than 25 ?ms (1 mil) and be void-free. It is desired to use a clear adhesive which does not contain any particles in order to obtain a smooth uniform void-free bondline. However, clear adhesives have CTE's that are larger than 80 ppm/° C. and which can be as high as 200 ppm/° C.Type: ApplicationFiled: April 2, 2009Publication date: February 11, 2010Inventor: John Farah
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Publication number: 20090219541Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to. coherent and incoherent light.Type: ApplicationFiled: March 2, 2009Publication date: September 3, 2009Inventor: John Farah
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Publication number: 20090109560Abstract: This invention concerns the fabrication of deformable mirrors that can be used for adaptive optics applications to correct wavefront aberrations. The deformable mirror uses a polyimide substrate with a PZT layer, which is cut by laser to produce a structure with a free end attached to the polyimide substrate at one corner. The deformable mirror has an aperture less than 10 cm and is cost-effective to produce. The deformable mirror is driven piezoelectrically as a bimorph or monomorph and can achieve a stroke of 15 microns and a bandwidth of 1 kHz for less than 20 volts. The deformable mirror uses a continuous sheet, which is anchored at only one point, which corresponds to the point of arbitrary zero phase, and is free everywhere else to conform to the wavefront. This cannot be achieved with silicon micromachined mirrors, which are electrostatically actuated because surface micromachining produces delicate films which must be anchored periodically for support.Type: ApplicationFiled: October 3, 2007Publication date: April 30, 2009Inventor: John Farah
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Patent number: 7512297Abstract: Polyimide substrates, and polymer laminates for optical and electronic applications are described. Single or multi-layer waveguide structures are deposited on the polyimide substrates. Laminates including polymer or a hybrid organic/inorganic waveguiding film can be deposited on a polished polyimide substrate. The laminate can also include piezoelectric and metallic layers. Micromachined optical devices, such as cantilevered waveguide are fabricated by laser ablation using a combination of IR and UV lasers. A fiber-to-waveguide coupler with a laser-machined groove for holding the fiber is also disclosed. Holes are drilled with excimer and YAG laser in the polyimide substrate and metallized to provide continuous electrical contact between both sides of the substrate. Metallized polyimide substrates are bumped and stacked to provide high density interconnects. The polyimide substrate is bonded to a semiconductor wafer.Type: GrantFiled: October 1, 2007Date of Patent: March 31, 2009Inventor: John Farah
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Patent number: 7499174Abstract: An image of an object can be synthesized either from the Fourier components of the electric field or from the Fourier components of the intensity distribution. Imaging with a lens is equivalent to assembling the Fourier components of the electric field in the image plane. This invention provides a method and a means for lensless imaging by assembling the Fourier components of the intensity distribution and combining them to form the image with the use of amplitude splitting interferometer. The angular spectrum of the electromagnetic radiation consists of wavefronts propagating at different angles. The amplitude of each wavefront is split and interfered with itself to create sinusoidal fringe patterns having different spatial frequencies. The sinusoidal fringe patterns are combined to form an image of the object. This method applies to coherent and incoherent light.Type: GrantFiled: January 12, 2006Date of Patent: March 3, 2009Inventor: John Farah