Abstract: A flex circuit blind attachment apparatus is provided and includes a plate, a fastening member affixable to the plate and configured to draw the plate toward and away from a circuit board and jaws supportively disposed on the plate. The jaws are configured to be opened with the plate being drawn toward the circuit board such that a pin of a flex connector to be connected to the circuit board is released by the jaws following disconnection of the flex connector and the circuit board. The jaws are also configured to capture the pin with the plate being drawn away from the circuit board prior to connection of the flex connector and the circuit board.

Abstract: An enhanced computer assembly and related method is provided that enables easy shipment and installation of such computing systems. In one embodiment a split top hat design is provided that can be removed. The removable split hat comprises a receiving member and an inner member that are secured to the frame in a manner that can be easily removed. In an alternate embodiment, a collapsible top hat is provided which adjusts the height of the assembly from a first to a second position. The collapsible feature has an upper portion that is connected to a plurality of pivoted side members that are capable of collapsing onto themselves.

Abstract: A flex circuit blind attachment apparatus is provided and includes a plate, a fastening member affixable to the plate and configured to draw the plate toward and away from a circuit board and jaws supportively disposed on the plate. The jaws are configured to be opened with the plate being drawn toward the circuit board such that a pin of a flex connector to be connected to the circuit board is released by the jaws following disconnection of the flex connector and the circuit board. The jaws are also configured to capture the pin with the plate being drawn away from the circuit board prior to connection of the flex connector and the circuit board.

Abstract: A cable assembly structure, the structure including a connector having a connector body having a back end and a front end, a cam extending from and coupled to the back end of the connector body, a wire bundle extending from and coupled to the back end of the connector body; and a pair of guidance features extending from the front end of the connector body; and a receptacle having a receptacle body having a fixed end and an open end, and a pair of cam guides positioned on a top and a bottom surface of the receptacle. The cam is operable to couple the connector with the receptacle based on the guidance features aligning the connector with the receptacle, the cam guides being operable to receive the cam associated with the connector.

Abstract: A system to operationally connect logic nodes may include an inter-nodal circuit to provide communications between any connected logic nodes. The system may also include a fabric bus that may be physically separate from the inter-nodal circuit, the fabric bus may provide logical connections restricted to any two connected logic nodes. The system may further include a clock circuit carried by the inter-nodal circuit that controls both the inter-nodal circuit and the fabric bus.

Abstract: A shared system to operationally connect logic nodes may include an inter-nodal circuit to provide communications between any connected logic nodes. The system may also include a fabric bus carried by the inter-nodal circuit, the fabric bus to provide logical connections to a first logic node and any other logic node. The system may further include a clock circuit carried by the inter-nodal circuit that controls both the inter-nodal circuit and the fabric bus.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A cable assembly structure, the structure including a connector having a connector body having a back end and a front end, a cam extending from and coupled to the back end of the connector body, a wire bundle extending from and coupled to the back end of the connector body; and a pair of guidance features extending from the front end of the connector body; and a receptacle having a receptacle body having a fixed end and an open end, and a pair of cam guides positioned on a top and a bottom surface of the receptacle. The cam is operable to couple the connector with the receptacle based on the guidance features aligning the connector with the receptacle, the cam guides being operable to receive the cam associated with the connector.

Abstract: A system to mate electronic assemblies includes a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system also includes a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.

Abstract: A system to mate logic nodes may include a connector to secure at least one of an inter-nodal circuit and a fabric bus, where the inter-nodal circuit provides communications between any connected logic nodes, and the fabric bus provides logical connections to a first logic node and any other logic node. The system may also include an element carried by the connector configured to provide an appropriate actuation force to mate the connector and at least one of the inter-nodal circuit and the fabric bus.

Abstract: A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

Abstract: A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.

Abstract: A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.

Abstract: A system to mate logic nodes may include a connector to secure at least one of an inter-nodal circuit and a fabric bus, where the inter-nodal circuit provides communications between any connected logic nodes, and the fabric bus provides logical connections to a first logic node and any other logic node. The system may also include an element carried by the connector configured to provide an appropriate actuation force to mate the connector and at least one of the inter-nodal circuit and the fabric bus.

Abstract: A shared system to operationally connect logic nodes may include an inter-nodal circuit to provide communications between any connected logic nodes. The system may also include a fabric bus carried by the inter-nodal circuit, the fabric bus to provide logical connections to a first logic node and any other logic node. The system may further include a clock circuit carried by the inter-nodal circuit that controls both the inter-nodal circuit and the fabric bus.

Abstract: A system to operationally connect logic nodes may include an inter-nodal circuit to provide communications between any connected logic nodes. The system may also include a fabric bus that may be physically separate from the inter-nodal circuit, the fabric bus may provide logical connections restricted to any two connected logic nodes. The system may further include a clock circuit carried by the inter-nodal circuit that controls both the inter-nodal circuit and the fabric bus.

Abstract: A system to mate electronic assemblies may include a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system may also include a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.