Abstract: A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate that is abrasive blasted is provided. Abrasive blasting may accomplish a variety of different purposes. For example, it may result in a surface that is substantially uniform and macroscopically smooth, thereby increasing the consistency of conductive coatings formed thereon. While possessing a certain degree of smoothness, the abrasive blasted surface is nevertheless micro-roughened so that it contains a plurality of pits. The pits provide an increased surface area, thereby allowing for increased cathode capacitance for a given size and/or capacitors with a reduced size for a given capacitance. A conductive coating that contains a substituted polythiophene is disposed on the micro-roughened surface.

Abstract: A wet electrolytic capacitor that contains a sintered anode positioned with an interior space of a metal casing is provided. The anode and metal casing are of a size such that the anode occupies a substantial portion of the volume of the interior space. More particularly, the anode typically occupies about 70 vol. % or more, in some embodiments about 75 vol. % or more, in some embodiments from about 80 vol. % to about 98 vol. %, and in some embodiments, from about 85 vol. % to 95 vol. % of the interior space. Among other things, the use of an anode that occupies such a large portion of the interior space enhances volumetric efficiency and other electrical properties of the resulting capacitor.

Abstract: A wet electrolytic capacitor that includes a porous anode body that contains a dielectric layer formed by anodic oxidation; a cathode that includes a metal substrate coated with a conductive polymer; and an aqueous electrolyte disposed in contact with the cathode and the anode is provided. The electrolyte includes a salt of a weak organic acid and water. The electrolyte has a pH of from about 5.0 to about 8.0 and an ionic conductivity of from about 0.5 to about 80 milliSiemens per centimeter or more, determined at a temperature of 25° C.

Abstract: A wet electrolytic capacitor that contains a hermetically sealed lid assembly is disclosed. More specifically, the lid assembly contains a lid (e.g., titanium) that defines an internal orifice. A conductive tube may extend through the orifice that is of a size and shape sufficient to accommodate an anode lead. An insulative material is also provided within the orifice to form a hermetic seal (e.g., glass-to-metal seal), such as between the conductive tube and the lid. The lid assembly also includes a liquid seal that is formed from a sealant material. The liquid seal coats a substantial portion of the lower surface of the lid and hermetic seal to limit contact with any electrolyte that may leak from the casing. To help achieve such surface coverage, the sealant material is generally flowable so that it can be heated during production of the capacitor and flow into small crevices that would otherwise remains uncoated.

Abstract: An electrolytic capacitor that contains an anodically oxidized porous anode, cathode, and an electrolyte that contains an alkali metal salt and ionically conductive polymer is provided. The alkali metal salt forms a complex with the ionically conductive polymer and thereby improves its ionic conductivity, particularly at higher temperatures. The electrolyte also contains an organic solvent that reduces the viscosity of the electrolyte and helps lower the potential barrier to metal ion transport within the electrolyte to improve conductivity. By selectively controlling the relative amount of each of these components, the present inventors have discovered that a highly ionically conductive electrolyte may be formed that is also in the form of a viscous liquid. The liquid nature of the electrolyte enables it to more readily enter the pores of the anode via capillary forces and improve specific capacitance. Further, although a liquid, its viscous nature may inhibit the likelihood of leakage.

Abstract: A wet electrolytic capacitor that contains a hermetically sealed lid assembly is disclosed. More specifically, the lid assembly contains a lid (e.g., titanium) that defines an internal orifice. A conductive tube may extend through the orifice that is of a size and shape sufficient to accommodate an anode lead. An insulative material is also provided within the orifice to form a hermetic seal (e.g., glass-to-metal seal), such as between the conductive tube and the lid. The lid assembly also includes a liquid seal that is formed from a sealant material. The liquid seal coats a substantial portion of the lower surface of the lid and hermetic seal to limit contact with any electrolyte that may leak from the casing. To help achieve such surface coverage, the sealant material is generally flowable so that it can be heated during production of the capacitor and flow into small crevices that would otherwise remains uncoated.

Abstract: A wet electrolytic capacitor that contains a sintered anode positioned with an interior space of a metal casing is provided. The anode and metal casing are of a size such that the anode occupies a substantial portion of the volume of the interior space. More particularly, the anode typically occupies about 70 vol. % or more, in some embodiments about 75 vol. % or more, in some embodiments from about 80 vol. % to about 98 vol. %, and in some embodiments, from about 85 vol. % to 95 vol. % of the interior space. Among other things, the use of an anode that occupies such a large portion of the interior space enhances volumetric efficiency and other electrical properties of the resulting capacitor.

Abstract: A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate that is abrasive blasted is provided. Abrasive blasting may accomplish a variety of different purposes. For example, it may result in a surface that is substantially uniform and macroscopically smooth, thereby increasing the consistency of conductive coatings formed thereon. While possessing a certain degree of smoothness, the abrasive blasted surface is nevertheless micro-roughened so that it contains a plurality of pits. The pits provide an increased surface area, thereby allowing for increased cathode capacitance for a given size and/or capacitors with a reduced size for a given capacitance. A conductive coating that contains a substituted polythiophene is disposed on the micro-roughened surface.

Abstract: A wet electrolytic capacitor comprising a porous anode body that contains a dielectric layer formed by anodic oxidation; a cathode comprising a metal substrate coated with a conductive polymer; and an aqueous electrolyte disposed in contact with the cathode and the anode is provided. The electrolyte comprises a salt of a weak organic acid and water. The electrolyte has a pH of from about 5.0 to about 8.0 and an ionic conductivity of from about 0.5 to about 80 milliSiemens per centimeter or more, determined at a temperature of 25° C.

Abstract: An electrolytic capacitor that contains an anodically oxidized porous anode, cathode, and an electrolyte that contains an alkali metal salt and ionically conductive polymer is provided. The alkali metal salt forms a complex with the ionically conductive polymer and thereby improves its ionic conductivity, particularly at higher temperatures. The electrolyte also contains an organic solvent that reduces the viscosity of the electrolyte and helps lower the potential barrier to metal ion transport within the electrolyte to improve conductivity. By selectively controlling the relative amount of each of these components, the present inventors have discovered that a highly ionically conductive electrolyte may be formed that is also in the form of a viscous liquid. The liquid nature of the electrolyte enables it to more readily enter the pores of the anode via capillary forces and improve specific capacitance. Further, although a liquid, its viscous nature may inhibit the likelihood of leakage.

Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of first and second polarity electrode layers. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups and thin-film plated deposition is formed thereon by electroless and/or electrolytic plating techniques. A solder dam layer is provided over a given component surface and formed to expose predetermined areas where solder barrier and flash materials may be deposited before attaching solder preforms. Some embodiments include plated terminations substantially covering selected component surfaces to facilitate with heat dissipation and signal isolation for the electronic components.

Abstract: The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal filtering characteristics, over-voltage transient suppression capabilities, and land grid array (LGA) terminations. Embodiments of the present subject matter may define a single capacitor, a capacitor array, or a multilayer vertically integrated array with configurable equivalent electrical characteristics including equivalent series inductance (ESL), equivalent series resistance (ESR), and configurable capacitance and voltage clamping and transient suppression capabilities.

Abstract: Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, defining a narrow and controlled spacing between the lands that is intended to reduce the current loop area, thus reducing the component inductance. Further reduction in current loop area and thus component equivalent series inductance (ESL) may be provided by interdigitated terminations. Terminations may be formed by various electroless plating techniques, and may be directly soldered to circuit board pads. Terminations may also be located on “ends” of the capacitors to enable electrical testing or to control solder fillet size and shape. Two-terminal devices may be formed as well as devices with multiple terminations on a given bottom (mounting) surface of the device.

Abstract: Disclosed is methodology and apparatus for producing an asymmetrical filter for use with implantable medical devices, and in other input filtering environments. Differing forward and reverse characteristic responses are provided by inserting a low value resistor in series with heart connecting leads so that EMI input protection may be provided without significantly reducing energy transfer from the protected device. Improved protection against voltage transients is provided with present arrangements of differentiated series impedance. Higher frequency energy is allowed out of a subject device than is allowed into such device, which allows for attenuation of undesired frequency ranges entering the filter while allowing output pulses to exit without distortion.

Abstract: A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. First and second transition layer electrode portions are provided on a top surface of the multilayered arrangement on top of which a cover layer formed to define openings, or windows, therein is provided. The cover layer may be provided before device firing or may be printed on after firing using polymer or glass. Peripheral terminations are subsequently formed on the device periphery to connect selected electrode layers to respective transition layer electrode portions. Via terminations are formed in the cover layer openings, on top of which solder balls may be applied. Some of the terminations may be formed in accordance with various plating techniques as disclosed.

Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.

Abstract: A window via capacitor comprises a stacked multilayer configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. An alternative window via capacitor comprises a stacked configuration of a bottom window layer, a bottom transition layer, a plurality of first and second layers, followed by a top window layer and a top cover layer. Each first and second layer is preferably characterized by a sheet of dielectric material with a respective first or second electrode plate provided thereon. Adjacent first and second electrode plates form opposing active capacitor plates in the multilayer configuration. Portions of each first and second electrode plate extend to and are exposed on selected side portions of the periphery of the window via capacitor.

Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers.