Patents by Inventor John Gilbert Thayer

John Gilbert Thayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220128312
    Abstract: A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
    Type: Application
    Filed: November 8, 2021
    Publication date: April 28, 2022
    Inventors: Ryan James McGlen, John Gilbert Thayer
  • Patent number: 11168944
    Abstract: A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 9, 2021
    Assignee: Aavid Thermal Corp.
    Inventors: Ryan James McGlen, John Gilbert Thayer
  • Publication number: 20190293360
    Abstract: A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
    Type: Application
    Filed: January 23, 2019
    Publication date: September 26, 2019
    Inventors: Ryan James McGlen, John Gilbert Thayer
  • Publication number: 20190154353
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Application
    Filed: January 29, 2019
    Publication date: May 23, 2019
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Publication number: 20180087843
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Application
    Filed: August 28, 2017
    Publication date: March 29, 2018
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Patent number: 9746248
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: August 29, 2017
    Assignee: Thermal Corp.
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Publication number: 20140190667
    Abstract: A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
    Type: Application
    Filed: May 24, 2012
    Publication date: July 10, 2014
    Applicant: THERMAL CORP.
    Inventors: Ryan James McGlen, John Gilbert Thayer
  • Patent number: 8230907
    Abstract: A flexible heat pipe for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe includes a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: July 31, 2012
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Publication number: 20100170661
    Abstract: A flexible heat pipe is disclosed for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe comprises a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Application
    Filed: January 18, 2010
    Publication date: July 8, 2010
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Patent number: 7647961
    Abstract: A flexible heat pipe is disclosed for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe comprises a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: January 19, 2010
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Patent number: 7143818
    Abstract: An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with a capillary wick. A porous valve is arranged in fluid communication between the fluid inlet manifold and a blind end of the at least one blind passageway.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: December 5, 2006
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Donald M. Ernst
  • Patent number: 7129731
    Abstract: A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged with a semiconductor device during burn-in testing. A working fluid is disposed within the heat pipe in sufficient quantity to at least saturate the wick. A hollow tube is coiled around the exterior surface of the heat pipe such that a first set of interior coils are formed adjacent to the exterior surface. These interior coils are brazed to the exterior surface so as to enhance their thermal interface with the heat pipe. A second set of coils are wrapped around the first set of coils, in overlying relation to them.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Donald M. Ernst
  • Patent number: 7013956
    Abstract: An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with a capillary wick. A porous valve is arranged in fluid communication between the fluid inlet manifold and a blind end of the at least one blind passageway.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: March 21, 2006
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Donald M. Ernst