Abstract: An instrument system includes an instrument, a drive system, and a controller operably connected to a first drive mechanism and a second drive mechanism of the drive system. The controller is configured to operate the first drive mechanism and the second drive mechanism drive a flexible tensioning member of the instrument to cause movement of an end effector of the instrument while maintaining a tension applied to the flexible tensioning member of the instrument in a tension range.

Abstract: A system and method of controlling an end effector includes a drive unit having a first actuator and a second actuator, a moveable platform drivably coupled to the first actuator, first and second engagement members drivably coupled to the second actuator; and a control unit. The control unit is configured to actuate the first actuator to drive the platform, detect engagement of the first engagement member with a third engagement member of an instrument, detect engagement of the second engagement member with a fourth engagement member of the instrument, and actuate the second actuator to drive the first and second engagement members. Movement of the third and engagement member causes movement of a degree of freedom of an end effector of the instrument in a first direction. Movement of the fourth engagement member causes movement of the degree of freedom in a second direction opposite the first direction.

Abstract: A computer-assisted teleoperated surgical system includes one or more manipulator devices and other components. A manipulator device includes a first link, a second link coupled to a distal end of the first link, a third link coupled to the second link, and an instrument actuator coupled to the third link. A joint that couples the second link to the first link defines a yaw axis. A joint that couples the third link to the second link defines a pitch axis. The instrument actuator defines an insertion axis. The yaw, pitch, and insertion axes are fixed in relation to each other and intersect at a remote center of motion. The instrument actuator may insert a surgical instrument along the insertion axis roll and may roll the surgical instrument around the insertion axis. The proximal end of the first link may be coupled to a repositionable setup structure, which may optionally be mechanically grounded to an operating room table.

Abstract: In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package (10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).

Abstract: In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package(10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).

Abstract: An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the body. The electronic device includes several bonding pads. The socket includes a set of pins to provide interconnection to external electronic devices. The body also includes pin sockets providing interconnection to the electronic package. The pins and pin sockets of the body are also connected to the bonding pads of the electronic device. To provide the electrical interconnection between the electronic package, the electronic device located upon the semiconductor substrate in the socket body and the external circuitry connected to the body.