Abstract: An arrangement of applying flux in solid, liquid or gaseous form directly to the solder wave avoids prefluxing of printed circuit boards or other elements to be soldered or solder wetted. The process for wave soldering an element comprises the steps of forming a solder wave above a solder reservoir, applying a flux directly to the solder wave separately from a shield gas delivery means to blanket the solder wave, and conveying the element through at least a portion of the solder wave. The process is applicable to wave soldering under a shroud wherein a gas shield is supplied by diffusers under the shroud, the flux being applied by at least one gas applicator directly to the solder wave.

Abstract: A cover or shroud extends over a solder reservoir and has a slot for a solder wave to protrude therethrough. Gas is provided to blanket the solder wave and the shroud is positioned to reduce solder from contacting elements that are conveyed through the solder wave. The devise comprises a solder reservoir having at least one solder nozzle projected therefrom, a pump for forming a solder wave from the nozzle, a cover for covering at least a portion of the reservoir containing the solder wave, the cover having a longitudinal slot for the solder wave to pass therethrough and contain solder splatter caused by the solder wave falling into the solder reservoir. A gas supply provides gas under the cover and also provides a gas blanket over the solder wave, and a conveyor moves the element in a predetermined path over the cover ensuring at least a portion of the element passes through the solder wave.

Abstract: A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave. Circuit boards are generally supported by conveyor fingers at side edges and the fingers pass through the solder wave. End shrouds are provided at both ends of the solder wave to prevent the entry of air through the conveyor fingers and to ensure that the side edges of the circuit board are uniformly blanketed by shield gas directed to the side edges passing up through the slot in the cover plate. The under surface, front edge, back edge and side edges of a circuit board are therefore uniformly blanketed by shield gas as the board passes through a solder wave.

Abstract: A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave. Circuit boards are generally supported by conveyor fingers at side edges and the fingers pass through the solder wave. End shrouds are provided at both ends of the solder wave to prevent the entry of air through the conveyor fingers and to ensure that the side edges of the circuit board are uniformly blanketed by shield gas directed to the side edges passing up through the slot in the cover plate. The under surface, front edge, back edge and side edges of a circuit board are therefore uniformly blanketed by shield gas as the board passes through a solder wave.

Abstract: A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas knife is located to direct a stream of gas on an element such as a circuit board as it passes through the solder wave. The cover plate or shroud provides reduced oxides on the solder surfaces and the gas knife removes excess solder on elements that have been solder coated. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom and a pump for forming a solder wave from the nozzle. Two solder waves may be provided each with their own cover plate and gas supplied on each side of each wave below the cover plate.

Abstract: A cover plate extends over a solder reservoir and has a slot for a solder wave to extend up above the plate, a gas excluding oxygen is supplied under the cover plate and flows up through the slot on both sides of the solder wave to blanket the solder wave. It has been found that oxygen content on the surface of the solder and on the solder wave is reduced so that clean oxide free soldering occurs. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom, a pump for forming a solder wave from the nozzle, a cover plate for covering at least a portion of the reservoir having a longitudinal slot for the solder wave to pass therethrough. Provision is made for supplying pressurized gas, which is oxygen free, to pass upwards through the slot on both sides of the solder wave to provide a gas blanket over the solder wave, and a conveyor conveys elements to be soldered to pass through the solder wave.