Abstract: Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.

Abstract: A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.

Abstract: Polyimides useful in electronic applications are prepared by the reaction of at least one aromatic tetracarboxylic acid or functional derivative thereof with at least one diamine in benzonitrile solution. The preferred tetracarboxylic acid derivative and diamine are 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and bis(4-aminophenyl) sulfone, respectively. A second organic liquid, such as toluene, which is miscible with and has a lower boiling point than benzonitrile and which preferably forms an azeotropic mixture with water, is preferably also present.

Abstract: A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.

Abstract: Flame retardant polyphenylene ether compositions are provided which utilize a silicone fluid treated filler, such as a clay or fumed titanium oxide treated with a polydiorganosiloxane fluid.

Abstract: Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.

Abstract: The incorporation of silicone treated filler selected from carbon black, titanium dioxide or clay into polycarbonates or polyester carbonates has been found to provide polycarbonate compositions having improved flame retardant properties.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Abstract: An improved amorphous metal composite and process of making the composite. The amorphous metal composite comprises amorphous metal (e.g. iron) and a low molecular weight thermosetting polymer binder. The process comprises placing an amorphous metal in particulate form and a thermosetting polymer binder powder into a container, mixing these materials, and applying heat and pressure to convert the mixture into an amorphous metal composite.

Abstract: The process comprises placing an amorphous metal in particulate form and a low molecular weight (e.g., 1000-5000) thermosetting polymer binder powder into a container, mixing these materials, and applying heat and pressure to convert the mixture into an amorphous metal composite.

Abstract: A bondable enamel coated, insulated electrical conductor such as magnet wire. The bondable electrical conductor is formed by a base insulation coating on a metallic conductor such as wire, the base coating being a thermosetting, resin enamel, and a bondable overcoat of polyamide-imide enamel applied on said base coating. The polyamide-imide enamel includes residual solvent so that the polyamide-imide enamel is self-bondable.

Abstract: An elongate electrical conductor is continuously coated with electrostatically charged powder by passing the conductor upwardly through a tube into the upper portion of a container having a charged fluidized bed of the powder in a lower portion thereof. The tube extends upwardly through the bed and the tube height is adjusted relative to the upper surface of the bed to control the thickness of the powder coating. An array of electrodes having associated switches permits application of uniform coatings to conductors having a variety of shapes. Two or more conductors may be uniformly coated from the same fluidized bed in a container having a baffle which divides the upper portion into two or more compartments and spaced apart tubes extend upwardly into the different compartments.

Abstract: Electrocoating compositions are provided in the form of aqueous dispersions of particulated polyimide. In addition, a method is also described for electrocoating metallic conductors, such as copper wire or aluminum strip. The particulated polyimide aqueous dispersions can be electrodeposited at significantly lower voltages than the corresponding polyamide acid salts.

Abstract: Magnetic cores suitable for use in transformers, generators and motors are provided. The core is formed of a laminate of layers of substantially amorphous metal laminae compressed to a rigid composite.