Abstract: The present disclosure is directed to a light assembly employing uncharacterized light sources. An example device may comprise at least one light source, a memory and at least one interface. Light emitted by the at least one light source may be tested. Configuration data based on results of the testing may be stored in the memory. The above device may then be used in other assemblies. For example, a system may be assembled including at least one of the device and a power supply. The power supply may be able to read the configuration data from the memory and configure itself based on the configuration data. For example, to generate light with certain characteristics the power supply may use the configuration data to determine at least one drive current to cause the at least one device to emit light having the desired characteristics.

Abstract: A light emitting diode (LED) lighting system including a lighting apparatus comprising at least one printed circuit board having an array of light emitting diode (LED) chips mounted thereto, the printed circuit board including a segmented conductor pathway configured to electrically couple at least a portion of the array of LED chips, and a portion of the printed circuit board forming a card edge connector, the card edge connector including a portion of the segmented conductor pathway which provides an electrical contact configured to electrically couple the segmented conductor pathway to a power source.

Abstract: A light-emitting diode package is described comprising a body including a hollow having a rim that extends outwardly from an open end of the hollow. A light emitting diode is positioned in the hollow and opposite the open end. A nongaseous transparent optical medium fills the hollow and a phosphor-containing element (PCE) is disposed over the hollow sealing the open end. The PCE has a solid body and a lateral portion including a periphery and dividing a top and a bottom. The bottom of the PCE is convex and in contact with the nongaseous transparent optical medium and the periphery of the PCE is in contact with the rim.

Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

Abstract: A light emitting diode (LED) lighting system including a lighting apparatus comprising at least one printed circuit board having an array of light emitting diode (LED) chips mounted thereto, the printed circuit board including a segmented conductor pathway configured to electrically couple at least a portion of the array of LED chips, and a portion of the printed circuit board forming a card edge connector, the card edge connector including a portion of the segmented conductor pathway which provides an electrical contact configured to electrically couple the segmented conductor pathway to a power source.

Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

Abstract: A light-emitting diode package is described comprising a body including a hollow having a rim that extends outwardly from an open end of the hollow. A light emitting diode is positioned in the hollow and opposite the open end. A nongaseous transparent optical medium fills the hollow and a phosphor-containing element (PCE) is disposed over the hollow sealing the open end. The PCE has a solid body and a lateral portion including a periphery and dividing a top and a bottom. The bottom of the PCE is convex and in contact with the nongaseous transparent optical medium and the periphery of the PCE is in contact with the rim.

Abstract: A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.

Abstract: A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.

Abstract: There is described a lamp having a high-temperature glass envelope, at least one feedthrough assembly, and a light source disposed within the envelope; the at least one feedthrough assembly having an inner electrical lead connected to the light source, an outer electrical lead for conducting electrical energy from an outside source to the light source, and an intermediate connector electrically connecting the inner and outer electrical leads, the intermediate connector being resistant to oxidation within a temperature range up to 1200° C. and having a thermal expansion coefficient in the range of 0-2 ppm/° C.; and the intermediate connector being sealed within a seal area of the envelope.

Abstract: A tungsten alloy feedthrough for ceramic discharge vessels is used to form a hermetic seal with the ceramic body of the discharge vessel. The tungsten alloy comprises tungsten alloyed with a metal selected from titanium, vanadium or a combination thereof. The alloy may be formulated to have a coefficient of thermal expansion that closely matches that of the ceramic to prevent cracking. Preferably, the tungsten alloy contains from about 10 to about 35 wt. % of a metal selected from Ti, V, or a combination thereof.

Abstract: A high intensity discharge lamp (10) has an envelope (12) having a base end (12a), a middle portion (12b) and domed end (12c) arrayed along an envelope longitudinal axis (14). Two spaced apart electrical lead-ins (34, 36) are sealed in the base end (12a) and extend into the envelope (12). A substantially U-shaped frame (38) is within the envelope (12) and the U-shaped frame comprises glass tubing 26a. A light source (16) has an arc discharge capsule (16b) positioned within the frame (38) and a containment vessel (18) is spaced from and surrounds the arc discharge capsule 16b. The containment vessel (18) comprises a transparent structure (19) attached to the frame (38) and formed to provide multiple, independent, localized fractures capable of absorbing the given kinetic energy possessed by the shards.

Abstract: There is described a lamp having a high-temperature glass envelope, at least one feedthrough assembly, and a light source disposed within the envelope; the at least one feedthrough assembly having an inner electrical lead connected to the light source, an outer electrical lead for conducting electrical energy from an outside source to the light source, and an intermediate connector electrically connecting the inner and outer electrical leads, the intermediate connector being resistant to oxidation within a temperature range up to 1200° C and having a thermal expansion coefficient in the range of 0-2 ppm/° C.; and the intermediate connector being sealed within a seal area of the envelope.

Abstract: A coil bobbin (10) has a housing (12) having a floor (14) with at least one electrical lead-in (16) projecting therethrough for attachment to a printed circuit board (18). The at least one electrical lead-in (16) is provided with thermal-strain relief (20) between said floor (14) and the printed circuit board (18). In a preferred embodiment of the invention the strain relief takes the form of a loop formed in the lead-in.

Abstract: A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.

Abstract: A ceramic-metal article including a ceramic rod, a metal rod, and a braze joining the ceramic and metal rods at a braze area of a coaxial bore in the metal rod. The bore gradually decreases in diameter, having an inward seat area sized for close sliding fit about the ceramic, a larger brazing area near the joint end, and a void area intermediate the braze and seat areas. The ceramic is seated without brazing in the bore seat area. The side wall between the brazing area and the metal outer surface is about 0.030-0.080 inch. The braze includes an inner braze layer, an outer braze layer, and an interlayer about 0.030-0.090 inch thick. A shoulder between the brazing and void areas supports the interlayer during bonding while preventing bonding between the void area and the ceramic member, leaving a void space between the void area and the ceramic member. A venting orifice extends generally radially through the metal member from the outer surface to the void space.