Patents by Inventor John Hartenstine

John Hartenstine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CTE-matched heat pipe
    Patent number: 11022379
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: June 1, 2021
    Assignee: Aavid Thermal Corp.
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • CTE-MATCHED HEAT PIPE
    Publication number: 20190360761
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Application
    Filed: April 1, 2019
    Publication date: November 28, 2019
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • CTE-matched heat pipe
    Patent number: 10247486
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 2, 2019
    Assignee: Thermal Corp.
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • CTE-MATCHED HEAT PIPE
    Publication number: 20170176112
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Application
    Filed: March 3, 2017
    Publication date: June 22, 2017
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • CTE-MATCHED HEAT PIPE
    Publication number: 20110176276
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Application
    Filed: March 29, 2011
    Publication date: July 21, 2011
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • CTE-matched heat pipe
    Publication number: 20050139995
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Application
    Filed: February 24, 2005
    Publication date: June 30, 2005
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • Cooling system for electronics with improved thermal interface
    Patent number: 6883594
    Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: April 26, 2005
    Assignee: Thermal Corp.
    Inventors: David B. Sarraf, Robert E. DeHoff, John Hartenstine, John J. Todd, Jr.
  • Cooling system for electronics with improved thermal interface
    Publication number: 20040070933
    Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
    Type: Application
    Filed: August 26, 2003
    Publication date: April 15, 2004
    Inventors: David B. Sarraf, Robert E. DeHoff, John Hartenstine, John J. Todd
  • Cooling system for electronics with improved thermal interface
    Publication number: 20030102108
    Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Inventors: David B. Sarraf, Robert E. DeHoff, John Hartenstine, John J. Todd