Abstract: A burn-in test system. A burn-in test system includes a device under test (DUT), a temperature controller coupled to the DUT, and a test controller. During testing, the test controller: (a) sets a parameter of the DUT to a first value and applies a test stimulus to the DUT, and (b) sets the parameter of the DUT to a second value and applies the test stimulus to the DUT. A change in the value of the parameter results in a change in the amount of heat dissipated by the DUT. The temperature controller maintains the DUT at a pre-determined temperature during testing with the parameter set to both the first and the second values. The DUT may be further coupled to a module that comprises circuitry employed in a product-level application environment. The module is configured by the test controller to simulate a product-level application.

Abstract: An apparatus and method for measuring microprocessor case temperatures during testing. A groove is formed on a top surface of a lid covering a microprocessor, extending from an edge of the lid toward the center of the lid, in order to accept an insulated portion of a thermocouple. Depending on the size and shape of a sensing end of the thermocouple, either a step or notch may be formed at the interior end of the groove, near the center of the lid, to accept a sensing end of the thermocouple. Microprocessor case temperature is sensed during testing by the thermocouple, which is placed, and optionally bonded, within the groove and the step or notch.