Patents by Inventor John Hitt

John Hitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119420
    Abstract: A system and method automatically models online job applications provides assistance to job applicants completing the job applications. Initially, as job applicants complete online job applications, their previously collected personal profile is concurrently displayed for those job applicants to select data fields from that personal profile for use in filling out specific data fields in the job applications. This selection and use of personal profile information for completing the job applications is monitored and data points are generated and stored documenting the data fields the job applicants selected from the personal profiles and the associated data fields where those selected personal profile data fields are utilized to complete job applications. Data points are generated and stored documenting the data field associations, the data points are utilized to identify associations, and the associations are stored as models to be utilized to provide assistance to other job applicants.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Inventors: Dhwaj Raj, John Hitt, Joseph Michael Barratt, Maoyuan Yan, Varun Prasad
  • Patent number: 10790567
    Abstract: Enhanced air core transmission lines and transformers are disclosed. A transmission line or transformer is disposed on a dielectric substrate, with a first planar conductor on the dielectric substrate and a second planar conductor suspended above the first planar conductor. A set of support posts suspends the second planar conductor above the first planar conductor. Thermal performance of the transmission line or transformer is improved by having each of the set of support posts include a width which exceeds any gap between support posts. In some examples, openings are formed in the second planar conductor and may facilitate etching or other processes of forming the transmission line or transformer.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: September 29, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Subrahmanyam V. Pilla, John Hitt, Michael Roberg
  • Publication number: 20200266513
    Abstract: Enhanced air core transmission lines and transformers are disclosed. A transmission line or transformer is disposed on a dielectric substrate, with a first planar conductor on the dielectric substrate and a second planar conductor suspended above the first planar conductor. A set of support posts suspends the second planar conductor above the first planar conductor. Thermal performance of the transmission line or transformer is improved by having each of the set of support posts include a width which exceeds any gap between support posts. In some examples, openings are formed in the second planar conductor and may facilitate etching or other processes of forming the transmission line or transformer.
    Type: Application
    Filed: February 18, 2019
    Publication date: August 20, 2020
    Inventors: Subrahmanyam V. Pilla, John Hitt, Michael Roberg
  • Patent number: 8193609
    Abstract: A heterojunction bipolar transistor (HBT) device and system having electrostatic discharge ruggedness, and methods for making the same, are disclosed. An HBT device having electrostatic discharge ruggedness may include one or more emitter fingers including an emitter layer, a transition layer formed over the emitter layer, and an emitter cap layer formed over the transition layer.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: June 5, 2012
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Timothy Henderson, Jeremy Middleton, John Hitt
  • Publication number: 20090283802
    Abstract: A heterojunction bipolar transistor (HBT) device and system having electrostatic discharge ruggedness, and methods for making the same, are disclosed. An HBT device having electrostatic discharge ruggedness may include one or more emitter fingers including an emitter layer, a transition layer formed over the emitter layer, and an emitter cap layer formed over the transition layer.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 19, 2009
    Applicant: TRIQUINT SEMICONDUCTOR, INC.
    Inventors: Timothy Henderson, Jeremy Middleton, John Hitt