Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Abstract: The present disclosure provides an orthodontic article including the reaction product of the polymerizable composition. Further, the present disclosure provides polymerizable compositions and methods of making an orthodontic article. The method includes obtaining a polymerizable composition and selectively curing the polymerizable composition to form an orthodontic article. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an orthodontic article; and generating, with the manufacturing device by an additive manufacturing process, the orthodontic article based on the digital object. A system is also provided, including a display that displays a 3D model of an orthodontic article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an orthodontic article.

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at least one electrical power pad (20).

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at least one electrical power pad (20).

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at feast one electrical power pad (20).

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at feast one electrical power pad (20).

Abstract: Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position.