Abstract: A microelectromechanical systems (MEMS) device includes a MEMS die and an electrical circuit electrically connected to the MEMS die. The electrical circuit includes a first capacitor that produces a first output signal based on a signal received from the MEMS die, and a second capacitor that produces a second output signal based on a signal received from the MEMS die. The electrical circuit is configured to determine a nominal capacitance of the MEMS die based on a ratio of the first output signal to the second output signal and a ratio of the capacitances of the first and second capacitors.

Abstract: A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.

Abstract: A microelectromechanical systems (MEMS) device includes a MEMS die and an electrical circuit electrically connected to the MEMS die. The electrical circuit includes a first capacitor that produces a first output signal based on a signal received from the MEMS die, and a second capacitor that produces a second output signal based on a signal received from the MEMS die. The electrical circuit is configured to determine a nominal capacitance of the MEMS die based on a ratio of the first output signal to the second output signal and a ratio of the capacitances of the first and second capacitors.

Abstract: A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.

Abstract: A microelectromechanical system (MEMS) motor includes a substrate, a backplate, and a diaphragm. The substrate has a first surface and a second surface. The second surface has a slot that extends at least partially into the substrate. A port extends through the substrate. The backplate is mounted to the first surface of the substrate, and the backplate covers at least a portion of the port. The diaphragm is between the backplate and the substrate. The diaphragm moves with respect to the backplate in response to acoustic energy that passes through the port.

Abstract: A microelectromechanical system (MEMS) motor includes a substrate, a backplate, and a diaphragm. The substrate has a first surface and a second surface. The second surface has a slot that extends at least partially into the substrate. A port extends through the substrate. The backplate is mounted to the first surface of the substrate, and the backplate covers at least a portion of the port. The diaphragm is between the backplate and the substrate. The diaphragm moves with respect to the backplate in response to acoustic energy that passes through the port.

Abstract: A micro electro mechanical system (MEMS) microphone includes a base including a port extending through the base, a shim assembly, an ingress protection element, and a MEMS device. The shim assembly is disposed on the base and over the port. The shim assembly has a plurality of walls that form a hollow interior cavity. The shim assembly also has a top surface and a bottom surface coupled to the base. The ingress protection element extends over and is coupled to the top of the shim assembly to enclose the cavity of the shim assembly. The shim assembly elevates the ingress protection element above the base and is effective to prevent the passage of contaminants there through. The MEMS device includes a diaphragm and a back plate and is disposed over the ingress protection element.

Abstract: A micro electro mechanical system (MEMS) microphone includes a base including a port extending through the base, a shim assembly, an ingress protection element, and a MEMS device. The shim assembly is disposed on the base and over the port. The shim assembly has a plurality of walls that form a hollow interior cavity. The shim assembly also has a top surface and a bottom surface coupled to the base. The ingress protection element extends over and is coupled to the top of the shim assembly to enclose the cavity of the shim assembly. The shim assembly elevates the ingress protection element above the base and is effective to prevent the passage of contaminants there through. The MEMS device includes a diaphragm and a back plate and is disposed over the ingress protection element.

Abstract: An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coupled to the second amplifier, a second charge pump, and to the single MEMS transducer. A first capacitive load as measured at an input of first amplifier, and a second capacitive load as measured at an input of the second amplifier exist. The first capacitive load and the second capacitive load are balanced with respect to each other. A single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal. Both the first electrical signal and the second electrical signal are matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other.

Abstract: A micro electro mechanical system (MEMS) microphone includes a base including a port extending through the base, a shim assembly, an ingress protection element, and a MEMS device. The shim assembly is disposed on the base and over the port. The shim assembly has a plurality of walls that form a hollow interior cavity. The shim assembly also has a top surface and a bottom surface coupled to the base. The ingress protection element extends over and is coupled to the top of the shim assembly to enclose the cavity of the shim assembly. The shim assembly elevates the ingress protection element above the base and is effective to prevent the passage of contaminants there through. The MEMS device includes a diaphragm and a back plate and is disposed over the ingress protection element.

Abstract: An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coupled to the second amplifier, a second charge pump, and to the single MEMS transducer. A first capacitive load as measured at an input of first amplifier, and a second capacitive load as measured at an input of the second amplifier exist. The first capacitive load and the second capacitive load are balanced with respect to each other. A single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal. Both the first electrical signal and the second electrical signal are matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other.

Abstract: A microphone assembly includes a capacitive MEMS transducer and a bias circuit having a DC output coupled to the transducer. The microphone assembly also includes a differential amplifier having a first input coupled to a first output of the transducer, the differential amplifier having a second input coupled to a second output of the transducer. The microphone assembly further includes a first impedance matching network and a second impedance matching network configured to balance a first capacitive load at the first input of the amplifier and a second capacitive load at the second input of the amplifier. Electrical signals applied by the transducer to the first and second inputs of the amplifier are matched or approximately matched in magnitude and 180 degrees or approximately 180 degrees out of phase with respect to each other.

Abstract: An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coupled to the second amplifier, a second charge pump, and to the single MEMS transducer. A first capacitive load as measured at an input of first amplifier, and a second capacitive load as measured at an input of the second amplifier exist. The first capacitive load and the second capacitive load are balanced with respect to each other. A single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal. Both the first electrical signal and the second electrical signal are matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other.

Abstract: A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a pressure sensor. A lid enclosed the MEMS device and the integrated circuit.

Abstract: Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In another implementation, a sensor is disposed at or integrated with an insert, over which a micro electro mechanical system (MEMS) device is disposed in a MEMS microphone. In disposing the sensor at the lid or insert, significant space savings are achieved. Consequently, a small-sized microphone is provided and achieved allowing the microphone deployed in applications where miniaturization is required or advantageous.

Abstract: A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a temperature sensor. A lid enclosed the MEMS device and the integrated circuit.

Abstract: A micro electro mechanical system (MEMS) apparatus includes a substrate. The substrate includes a first surface and a second surface. The first surface and the second surface are on opposing sides of the substrate. A programming contact pad is disposed on the second surface of the substrate. A MEMS device is disposed on the first surface of the substrate. An integrated circuit is disposed on the first surface of the substrate and electrically connected to the MEMS device and the contact pad. An anti-fuse region is coupled to the pad and to ground. When the anti-fuse region is not fused, a first electrical path exists from the programming contact pad to the integrated circuit. When the anti-fuse region is fused, a second electrical path is created from the programming contact pad to ground and the first electrical path is no longer available for programming purposes.

Abstract: A microelectromechanical system (MEMS) apparatus includes a base. A MEMS device is disposed on the base. A cover encloses the MEMS device on the base. A port extends through the base, and the MEMS device is disposed over the port. A diaphragm is embedded within the base and has at least some portions that extend across the port. In an open position, the diaphragm allows the passage of sound energy from the exterior of the apparatus to the interior of the apparatus. In a closed position, the diaphragm makes contact with an outer surface of the port to at least partially block the passage of sound energy from the exterior of the apparatus to the interior of the apparatus.

Abstract: A micro electro mechanical system (MEMS) apparatus includes a substrate. The substrate includes a first surface and a second surface. The first surface and the second surface are on opposing sides of the substrate. A programming contact pad is disposed on the second surface of the substrate. A MEMS device is disposed on the first surface of the substrate. An integrated circuit is disposed on the first surface of the substrate and electrically connected to the MEMS device and the contact pad. An anti-fuse region is coupled to the pad and to ground. When the anti-fuse region is not fused, a first electrical path exists from the programming contact pad to the integrated circuit. When the anti-fuse region is fused, a second electrical path is created from the programming contact pad to ground and the first electrical path is no longer available for programming purposes.

Abstract: The present invention relates to monoclonal antibodies and a method for the quantification of apolipoprotein(a) and lipoprotein(a) present in human body fluids. The method is not sensitive to the presence of plasminogen or the apo(a) kringle 4 repeats. The assay involves the addition of the test sample to an immobilized anti-apo(a) antibody and forming a first immobilized complex of apolipoprotein(a)/anti-apo(a) first antibody, contacting first immune complex with an anti-apo(a) monoclonal antibody specific for apo(a) with no crossreactivity to plasminogen and which does not identify the kringle 4 type 2 apo(a) repeats and thereafter quantitating apo(a) based on the amount of bound anti-apo(a) monoclonal antibody. Immobilized goat or rabbit anti-human apo(a) antibody can be employed as the first capture antibody and the mouse anti-apo(a) monoclonal antibody as second antibody. The amount of anti-apo(a) monoclonal antibody bound is quantitated through binding of a third antibody enzyme conjugant, e.g.