Abstract: Analog test instrument architecture for performing functional testing of electronic circuit assemblies is disclosed. The analog test instrument includes a plurality of identical channels, each channel including circuitry for driving test stimuli and measuring responses at one node of a circuit assembly under test. The driver and measurement circuitry in each channel implement functions that traditionally have been implemented in a test system using discrete instruments. The analog test instrument further includes a master clock reference, which is used for synchronizing the operation of the driver and measurement circuits. Each channel further includes triggering circuitry for distributing trigger events within the channel and to the other channels; and, an input buffer, which is shared by the measurement circuits in the channel. The synchronized operation, distributed trigger events, and shared input buffers are used to improve the correlation of measurements made during functional testing.

Abstract: A rack (70) for a plurality of electronics modules (36) that does not include inlet and outlet air cooling plenums. The rack (70) includes a heat exchanger (72) including three separate sections (78, 80, 82), where each section (78, 80, 82) include spaced-apart parallel fins (84, 86, 88). First and second end sections (80, 82) of the heat exchanger (72) include cooling fins (86, 88) that extend parallel to each other in a front-to-back direction relative to the direction the modules (36) are slid into the rack (70). The first and second end sections (80, 82) are positioned at opposite ends of a center section (78), where the fins (84) of the center section (78) extend in a direction transverse to the direction the modules (36) are slid into the rack (70). The channels between the fins (86, 88) in the first and second end sections (80, 82) are aligned with inlet and outlet ports (94, 98) extending through a back panel (52) of the rack (70).

Abstract: A rack (70) for a plurality of internal electronics modules that includes a mechanism for mounting external electronics modules (69). The rack (70) includes a heat exchanger (63) disposed between the rack (70) and the external electronics module (69). The external electronics module (69) includes a heat coupling surface for efficiently using the heat exchanger (63) for dissipating heat of the external electronics module (69).

Abstract: A rack (70) for a plurality of electronics modules (36) that does not include inlet and outlet air cooling plenums. The rack (70) includes a heat exchanger (72) including three separate sections (78, 80, 82), where each section (78, 80, 82) include spaced-apart parallel fins (84, 86, 88). First and second end sections (80, 82) of the heat exchanger (72) include cooling fins (86, 88) that extend parallel to each other in a front-to-back direction relative to the direction the modules (36) are slid into the rack (70). The first and second end sections (80, 82) are positioned at opposite ends of a center section (78), where the fins (84) of the center section (78) extend in a direction transverse to the direction the modules (36) are slid into the rack (70). The channels between the fins (86, 88) in the first and second end sections (80, 82) are aligned with inlet and outlet ports (94, 98) extending through a back panel (52) of the rack (70).