Patents by Inventor John J. Fisher
John J. Fisher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11969249Abstract: Disclosed systems, methods, and products include a self-contained electroencephalogram (EEG) recording patch including a first electrode, a second electrode and where the first and second electrodes cooperate to measure a skin-electrode signal, a substrate containing circuitry for generating an EEG signal there-from, amplifying the EEG signal, digitizing the EEG signal, and retrievably storing the EGG signal in a programmatic fashion. The patch also comprises a power source and an enclosure that houses the substrate, the power source, and the first and second electrodes in a unitary package.Type: GrantFiled: April 28, 2021Date of Patent: April 30, 2024Assignee: Epitel, Inc.Inventors: Francis E. Dudek, Michael K. Elwood, John H. Fisher, Mark J. Lehmkuhle, Jean M. Wheeler
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Patent number: 11954022Abstract: Provided are a storage device, system, and method for throttling host writes in a host buffer to a storage device. The storage device is coupled to a host system having a host buffer that includes reads and writes to pages of the storage device. Garbage collection consolidates valid data from pages in the storage device to fewer pages. A determination is made as to whether a processing measurement at the storage device satisfies a threshold. A timer value is set to a positive value in response to determining that the processing measurement satisfies the threshold. The timer is started to run for the timer value. Writes from the host buffer are blocked while the timer is running. Writes remain in the host buffer while the timer is running. A write is accepted from the host buffer to process in response to expiration of the timer.Type: GrantFiled: March 2, 2022Date of Patent: April 9, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Matthew S. Reuter, Timothy J. Fisher, Aaron Daniel Fry, Jenny L. Brown, John Carrington Cates, Austin Eberle
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Patent number: 11944130Abstract: A vaporizer device includes various modular components. The vaporizer device includes a first subassembly. The first subassembly includes a cartridge connector that secures a vaporizer cartridge to the vaporizer device and includes at least two receptacle contacts that electrically communicate with the vaporizer cartridge. The vaporizer device includes a second subassembly. The second subassembly includes a skeleton defining a rigid tray that retains at least a power source. The vaporizer device also includes a third subassembly. The third subassembly includes a plurality of charging contacts that supply power to the power source, and an end cap that encloses an end of the vaporizer device.Type: GrantFiled: December 24, 2020Date of Patent: April 2, 2024Assignee: JUUL Labs, Inc.Inventors: Samuel C. Anderson, Wei-Ling Chang, Brandon Cheung, Steven Christensen, Joseph Chun, Joseph R. Fisher, Jr., Nicholas J. Hatton, Kevin Lomeli, James Monsees, Andrew L. Murphy, Claire O'Malley, John R. Pelochino, Hugh Pham, Vipul V. Rahane, Matthew J. Taschner, Val Valentine, Kenneth Wong
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Publication number: 20240100777Abstract: A light polymerizable composition for use in the additive manufacturing of medical devices may include a first photo-initiator and a second photo-initiator. The first photo-initiator activates to initiate curing of the composition when exposed to light of a first wavelength in an additive manufacturing device and the second photo-initiator limits the transmission of the light of the first wavelength that activates the first photo-initiator in the additive manufacturing device. The second photo-initiator is activated to further cure the composition when exposed to a light of a second wavelength different from the first wavelength by activating the second photo-initiator to produce free radicals at a higher rate when exposed to the light of the second wavelength than when exposed to the light of the first wavelength.Type: ApplicationFiled: November 27, 2023Publication date: March 28, 2024Inventors: H. David DEAN, Al SIBLANI, Eric J. MOTT, John P. FISHER, Martha O. WANG, Antonios G. MIKOS
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Publication number: 20190013561Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: ApplicationFiled: August 21, 2018Publication date: January 10, 2019Inventors: David W. Sherrer, John J. Fisher
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Patent number: 10074885Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: GrantFiled: March 24, 2016Date of Patent: September 11, 2018Assignee: NUVOTRONICS, INCInventors: David W. Sherrer, John J. Fisher
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Publication number: 20160268665Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: ApplicationFiled: March 24, 2016Publication date: September 15, 2016Inventors: David W. Sherrer, John J. Fisher
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Patent number: 9312589Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: GrantFiled: June 2, 2014Date of Patent: April 12, 2016Assignee: NUVOTRONICS, INC.Inventors: David W. Sherrer, John J. Fisher
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Publication number: 20140266515Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: ApplicationFiled: June 2, 2014Publication date: September 18, 2014Applicant: Nuvotronics, LLCInventors: David W. Sherrer, John J. Fisher
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Patent number: 8742874Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: GrantFiled: April 12, 2011Date of Patent: June 3, 2014Assignee: Nuvotronics, LLCInventors: David W. Sherrer, John J. Fisher
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Patent number: 8703603Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: November 11, 2010Date of Patent: April 22, 2014Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Patent number: 8203207Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.Type: GrantFiled: February 25, 2008Date of Patent: June 19, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: James W. Getz, David W. Sherrer, John J. Fisher
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Publication number: 20110210807Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: ApplicationFiled: April 12, 2011Publication date: September 1, 2011Inventors: David W. Sherrer, John J. Fisher
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Patent number: 7948335Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: GrantFiled: June 20, 2008Date of Patent: May 24, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, John J. Fisher
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Publication number: 20110079893Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: ApplicationFiled: November 11, 2010Publication date: April 7, 2011Inventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Patent number: 7914211Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.Type: GrantFiled: August 3, 2009Date of Patent: March 29, 2011Assignee: IP Cube Partners Co., Ltd.Inventors: John J. Fisher, Carl Gaebe
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Patent number: 7888793Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: October 31, 2006Date of Patent: February 15, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Publication number: 20100054674Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.Type: ApplicationFiled: August 3, 2009Publication date: March 4, 2010Inventors: John J. Fisher, Carl Gaebe
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Publication number: 20090256251Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.Type: ApplicationFiled: February 25, 2008Publication date: October 15, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: James W. Getz, David W. Sherrer, John J. Fisher
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Patent number: 7597488Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.Type: GrantFiled: June 1, 2006Date of Patent: October 6, 2009Assignee: Nuvotronics LLCInventor: John J. Fisher