Patents by Inventor John J. Ireland

John J. Ireland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit elements having an embedded conductive trace and methods of manufacture
    Patent number: 6824857
    Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: November 30, 2004
    Assignee: Nashua Corporation
    Inventors: Darren Lochun, John J. Ireland
  • Circuit elements having an embedded conductive trace and methods of manufacture
    Publication number: 20040209054
    Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.
    Type: Application
    Filed: May 4, 2004
    Publication date: October 21, 2004
    Applicant: Nashua Corporation
    Inventors: Darren Lochun, John J. Ireland
  • Circuit elements having an embedded conductive trace and methods of manufacture
    Publication number: 20020171065
    Abstract: Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.
    Type: Application
    Filed: April 1, 2002
    Publication date: November 21, 2002
    Applicant: Nashua Corporation
    Inventors: Darren Lochun, John J. Ireland