Patents by Inventor John J. Krantz

John J. Krantz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
    Publication number: 20130161805
    Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge, the at least one edge having one or more slots located therein. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of pairs of adjacent lead fingers extend into corresponding slots in the paddle.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 27, 2013
    Applicant: LSI Corporation
    Inventors: Clifford R. Fishley, John J. Krantz, Abiola Awujoola, Allen S. Lim, Stephen M. King, Lawrence W. Golick, Ashley Rebelo
  • INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
    Publication number: 20130161804
    Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of adjacent lead fingers are staggered proximate and distal the at least one edge.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 27, 2013
    Inventors: Clifford R. Fishley, John J. Krantz, Abiola Awujoola, Allen S. Lim, Stephen M. King, Lawrence W. Golick
  • Method of generating a leadframe IC package model, a leadframe modeler and an IC design system
    Patent number: 8370777
    Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: February 5, 2013
    Assignee: LSI Corporation
    Inventors: Donald E. Hawk, Jr., Stephen M. King, Jeffrey M. Klemovage, John J. Krantz, Allen S. Lim, Ashley Rebelo, Richard J. Sergi
  • METHOD OF GENERATING A LEADFRAME IC PACKAGE MODEL, A LEADFRAME MODELER AND AN IC DESIGN SYSTEM
    Publication number: 20100318340
    Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Applicant: LSI Corporation
    Inventors: Donald E. Hawk, JR., Stephen M. King, Jeffrey M. Klemovage, John J. Krantz, Allen S. Lim, Ashley Rebelo, Richard J. Sergi