Patents by Inventor John J. Svitak

John J. Svitak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic device
    Patent number: 4375606
    Abstract: A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: March 1, 1983
    Assignee: Western Electric Co.
    Inventors: Daniel A. Di Leo, Samuel E. Kurtz, John J. Svitak
  • Methods and apparatus for bonding an article to a metallized substrate
    Patent number: 4295596
    Abstract: A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.
    Type: Grant
    Filed: December 19, 1979
    Date of Patent: October 20, 1981
    Assignee: Western Electric Company, Inc.
    Inventors: Bradford O. Doten, John J. Svitak
  • Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
    Patent number: 4209358
    Abstract: A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
    Type: Grant
    Filed: December 4, 1978
    Date of Patent: June 24, 1980
    Assignee: Western Electric Company, Incorporated
    Inventors: Daniel A. DiLeo, Samuel E. Kurtz, John J. Svitak