Patents by Inventor John Joseph Konrad
John Joseph Konrad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6919514Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.Type: GrantFiled: September 15, 2003Date of Patent: July 19, 2005Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Jeffrey McKeveny, James Warren Wilson
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Patent number: 6730857Abstract: Embedded flush circuitry features are fabricated by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a later of dielectric material.Type: GrantFiled: March 13, 2001Date of Patent: May 4, 2004Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Jeffrey McKeveny, James Warren Wilson
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Publication number: 20040064939Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.Type: ApplicationFiled: September 15, 2003Publication date: April 8, 2004Applicant: International Business Machines CorporationInventors: John Joseph Konrad, Jeffrey McKeveny, James Warren Wilson
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Patent number: 6534186Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4−(n+m) III wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.Type: GrantFiled: March 27, 2001Date of Patent: March 18, 2003Assignee: International Business Machines CorporationInventors: Konstantinos Papathomas, Bernd Karl Appelt, John Joseph Konrad
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Patent number: 6524654Abstract: In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent.Type: GrantFiled: July 31, 2000Date of Patent: February 25, 2003Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Konstantinos I. Papathomas, John A. Welsh
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Patent number: 6485892Abstract: Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an external surface of the substrate, forming a predetermined pattern in the photoimageable material, circuitizing the predetermined pattern and then removing both the photoimageable material and the liquid material from the through-holes.Type: GrantFiled: December 17, 1999Date of Patent: November 26, 2002Assignee: International Business Machines CorporationInventors: Lawrence Robert Blumberg, Norman A. Card, Jr., Richard Allen Day, Stephen J. Fuerniss, John Joseph Konrad, Jeffrey McKeveny, Timothy L. Wells
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Patent number: 6455139Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.Type: GrantFiled: July 31, 2001Date of Patent: September 24, 2002Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Konstantinos I. Papathomas, Timothy Leroy Wells, James Warren Wilson
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Publication number: 20020129972Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.Type: ApplicationFiled: March 13, 2001Publication date: September 19, 2002Applicant: International Business Machines CorporationInventors: John Joseph Konrad, Jeffrey McKeveny, James Warren Wilson
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Patent number: 6432182Abstract: In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent.Type: GrantFiled: June 6, 2000Date of Patent: August 13, 2002Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Konstantinos I. Papathomas, John A. Welsh
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Publication number: 20010040047Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.Type: ApplicationFiled: July 31, 2001Publication date: November 15, 2001Inventors: John Joseph Konrad, Konstantinos I. Papathomas, Timothy Leroy Wells, James Warren Wilson
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Patent number: 6296897Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.Type: GrantFiled: August 12, 1998Date of Patent: October 2, 2001Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Konstantinos I. Papathomas, Timothy Leroy Wells, James Warren Wilson
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Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability
Patent number: 6251469Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4-(n+m) III wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.Type: GrantFiled: March 19, 1997Date of Patent: June 26, 2001Assignee: International Business Machines, CorporationInventors: Konstantinos Papathomas, Bernd Karl Appelt, John Joseph Konrad -
Patent number: 6099959Abstract: In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent.Type: GrantFiled: July 1, 1998Date of Patent: August 8, 2000Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Konstantinos I. Papathomas, John A. Welsh
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Patent number: 5893983Abstract: A technique for polishing an exposed surface of metal on a substrate to remove defects from mechanical working of metals, such as burrs and pigtails resulting from drilling, and defects from plating, such as nodules and depressions, is provided. The substrate has an exposed metal surface such as copper thereon which is to be treated to remove defects. A planarizing or polishing head, preferably a rotating roller, is provided which is continuously rotating with respect to the substrate, with the head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the head. The treating and polishing continues until the defects have been removed or reduced to an acceptable value. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used.Type: GrantFiled: November 19, 1996Date of Patent: April 13, 1999Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Voya Rista Markovich, George Frederick Reel, Jose Antonio Rios, Timothy Leroy Wells, Michael Wozniak
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Patent number: 5733466Abstract: Electrodepositing a metallurgy such as gold on to printed circuit board features. The methods include electrolessly depositing a copper layer over the surface of the printed circuit board. This is followed by applying a layer of photoresist atop the electroless copper, and exposing and developing the photoresist to uncover areas to be etched, leaving behind the specific features to be plated. By this expedient the remaining copper forms a commoning layer. The remaining photoresist is stripped to uncover the copper commoning layer, and a second layer of photoresist is applied atop the partially etched copper layer. This layer of photoresist is exposed and developed to uncover the features to be plated. These features are then plated with the metallurgy of choice. The photoresist is then stripped off and the electroless copper layer can remain if needed for further processing or be microetched off without harming copper traces that may exist below the electroless copper layer.Type: GrantFiled: February 6, 1996Date of Patent: March 31, 1998Assignee: International Business Machines CorporationInventors: Biebele Opubo Benebo, Edmund Glenn Benjamin, Robert Douglas Edwards, John Joseph Konrad, Timothy Leroy Wells, Jerzy Maria Zalesinski
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Patent number: 5723339Abstract: A method of analyzing for As(III) as AsO.sub.2.sup.-1 ion in an Au(I) containing electroplating solution. The concentration of As(III) in the electroplating solution is maintained high enough to avoid formation of "burnt Au" oxides but low enough to avoid bond failures. A sample of the electroplating solution is withdrawn and added to a buffered solution, for example an acetate-ethylene diamine tetraacetic acid (EDTA) buffered solution. A complexing agent for Au(I) ion is added to the buffered solution. This can be an alkali metal cyanide. Next ammonium pyrrolidine dithiocarbamate is added as a complexing agent for the AsO.sub.2.sup.-1 ion. The ammonium pyrrolidine dithiocarbamate--AsO.sub.2.sup.-1 ion is extracted, for example with methyl isobutyl ketone (MIBK). The extract is analyzed for As(III) by atomic absorption, as electrothermal atomic absorption spectrometry.Type: GrantFiled: April 15, 1996Date of Patent: March 3, 1998Assignee: International Business Machines CorporationInventors: John Joseph Konrad, Robert Anthony Sinicki