Patents by Inventor John L. Canning

John L. Canning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4551390
    Abstract: This invention pertains to a method to permit the molding of a plurality of plies of polymeric compositions into an integral molded object having a minimum number of internal flaws and, therefore, improved properties. The plies are positioned in contiguous relationship, and the initiation of the polymerization reactions is controlled by selecting catalyst systems which substantially simultaneously initiate polymerization in each of the plies to prevent the development of curing seams at the points of contact between the plies.
    Type: Grant
    Filed: May 9, 1983
    Date of Patent: November 5, 1985
    Assignee: Owens-Corning Fiberglas Corporation
    Inventors: John L. Canning, John F. Kay
  • Patent number: 4404261
    Abstract: This invention pertains to a method to permit the molding of a plurality of plies of polymeric compositions into an integral molded object having a minimum number of internal flaws and, therefore, improved properties. The plies are positioned in contiguous relationship, and the initiation of the polymerization reactions is controlled by selecting catalyst systems which substantially simultaneously initiate polymerization in each of the plies to prevent the development of curing seams at the points of contact between the plies.
    Type: Grant
    Filed: October 13, 1981
    Date of Patent: September 13, 1983
    Assignee: Owens-Corning Fiberglas Corporation
    Inventors: John L. Canning, John F. Kay
  • Patent number: 3986992
    Abstract: This invention pertains to a one-component, low shrink molding resin system comprising a thermoplastic, branched alkyd in combination with a thermosetting dicyclopentadiene modified polyester resin. The low shrink molding resin systems are stabilized dispersions wherein the branched thermoplastic alkyd is dispersed within the dicyclopentadiene polyester resin (polyester polymer + monomer) to provide a uniform dispersion. The low shrink molding resin system can be thickened with alkaline earth and/or hydroxide thickeners suitable for use in low shrink molding compositions for producing low-profile molded parts.
    Type: Grant
    Filed: April 16, 1975
    Date of Patent: October 19, 1976
    Assignee: SCM Corporation
    Inventors: John L. Canning, Robert W. Lottig
  • Patent number: RE29555
    Abstract: This invention pertains to a one-component, low shrink molding resin system comprising a thermoplastic, branched alkyd in combination with a thermosetting dicyclopentadiene modified polyester resin. The low shrink molding resin systems are stabilized dispersions wherein the branched thermoplastic alkyd is dispersed within the dicyclopentadiene polyester resin (polyester polymer + monomer) to provide a uniform dispersion. The low shrink molding resin system can be thickened with alkaline earth and/or hydroxide thickeners suitable for use in low shrink molding compositions for producing low-profile molded parts.
    Type: Grant
    Filed: February 14, 1977
    Date of Patent: February 28, 1978
    Assignee: SCM Corporation
    Inventors: John L. Canning, Robert W. Lottig