Patents by Inventor John L. Zich

John L. Zich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for metallization of a substrate by curing a catalyst applied thereto
    Patent number: 6461678
    Abstract: An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: October 8, 2002
    Assignee: Sandia Corporation
    Inventors: Ken S. Chen, William P. Morgan, John L. Zich
  • Process for metallization of a substrate by irradiative curing of a catalyst applied thereto
    Patent number: 5989653
    Abstract: An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: November 23, 1999
    Assignee: Sandia Corporation
    Inventors: Ken S. Chen, William P. Morgan, John L. Zich