Patents by Inventor John M. Clayton, Jr.

John M. Clayton, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8866150
    Abstract: A silicon carbide power device is fabricated by forming a p-type silicon carbide epitaxial layer on an n-type silicon carbide substrate, and forming a silicon carbide power device structure on the p-type silicon carbide epitaxial layer. The n-type silicon carbide substrate is at least partially removed, so as to expose the p-type silicon carbide epitaxial layer. An ohmic contact is formed on at least some of the p-type silicon carbide epitaxial layer that is exposed. By at least partially removing the n-type silicon carbide substrate and forming an ohmic contact on the p-type silicon carbide epitaxial layer, the disadvantages of using a p-type substrate may be reduced or eliminated. Related structures are also described.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: October 21, 2014
    Assignee: Cree, Inc.
    Inventors: Mrinal Kanti Das, Qingchun Zhang, John M. Clayton, Jr., Matthew Donofrio
  • Publication number: 20080296771
    Abstract: A silicon carbide power device is fabricated by forming a p-type silicon carbide epitaxial layer on an n-type silicon carbide substrate, and forming a silicon carbide power device structure on the p-type silicon carbide epitaxial layer. The n-type silicon carbide substrate is at least partially removed, so as to expose the p-type silicon carbide epitaxial layer. An ohmic contact is formed on at least some of the p-type silicon carbide epitaxial layer that is exposed. By at least partially removing the n-type silicon carbide substrate and forming an ohmic contact on the p-type silicon carbide epitaxial layer, the disadvantages of using a p-type substrate may be reduced or eliminated. Related structures are also described.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 4, 2008
    Inventors: Mrinal Kanti Das, Qingchun Zhang, John M. Clayton, JR., Matthew Donofrio
  • Patent number: 6076678
    Abstract: An animal carcass wrapping kit for use by hunters in the field to decrease the possibility of deer tick infection, the carcass wrapping kit having a wrap cloth positioned within a hermetically sealed housing member, the wrap cloth being impregnated with a deer tick repellant prior to its positioning within the hermetically sealed housing member or while in the hermetically sealed housing member immediately prior to use by way of a fracturable ampule of vial within the hermetically sealed housing member containing the deer tick repellant.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: June 20, 2000
    Inventor: John M. Clayton, Jr.