Abstract: An hermetically sealed, air-less multi-chambered structure for cooling semiconductor chips mounted on a substrate or printed circuit board which employs means for selectively providing a boiling-coolant generation of vapor bubbles for cooling purposes.

Abstract: An apparatus for containing and cooling high-density integrated circuit packages includes a housing in which the circuit package is sealingly mounted in an internal chamber of said housing. The chamber is at least partially filled with a plurality of thermally conductive spheroids which are biased into thermally conductive contact with each other and with the integrated circuit package to maximize the heat exchange surface. The apparatus includes an inlet and an outlet for passing a dielectric immersion coolant through the chamber in direct heat exchange relationship with the spheroids and with the high-density integrated circuit package.

Abstract: An apparatus for cooling a high-density integrated circuit package includes a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the operational heat thereof by means of a coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber with an especially configured thermally conductive wall for engaging the integrated circuit package. The coolant chamber is filled with a plurality of thermally conductive spheroids which are biased into thermally conductive contact with each other and with the special wall to maximize the heat exchange surface in the coolant chamber. The apparatus is preferably employed in combination with a refrigeration system wherein the coolant chamber is the evaporation element of the system for maximum cooling of the integrated circuit package.

Abstract: An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof by means of a fluid coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber one surface of which is formed of a pliable thinwall diaphragm of thermally conductive material. The coolant chamber is filled with a plurality of thermally conductive spheriods which are biased into thermally conductive contact with each other and with the diaphragm by a resilient elastomeric pressure pad which is mounted in the coolant chamber. The biasing force exerted by the spheroids on the diaphragm biases it into thermally conductive contact with the circuit package so that heat is conducted away from the circuit package by the diaphragm and the spheroids.

Abstract: An apparatus for cooling a high-density integrated circuit package including a base in which the circuit package is mounted and a heat exchanger which mounts on the base to enclose the circuit package and carry away the heat generated by operation thereof by means of a fluid coolant which is passed through the heat exchanger. The heat exchanger includes a housing having a coolant chamber one surface of which is formed of a pliable thin-wall metallic diaphragm which is biased into heat conductive contact with the circuit package by biasing structures provided in the coolant chamber of the heat exchanger housing.

Abstract: A liquid cooled connector for mounting and electrically connecting an integrated circuit package on one side of a backpanel, said connector including a thrust/heat dissipating member for placement on the integrated circuit package, a thrust inducing mounting plate for positioning on the opposite side of the backpanel, and complemental elements of a demountable biasing connection passing through the backpanel so as to interconnect the thrust inducing mounting plate and the thrust/heat dissipating member to cause an interaction therebetween which pressurizes the integrated circuit package into conductive contact with the backpanel.

Abstract: A connector for demountably attaching an integrated circuit package to a backpanel and forming an electrically conductive pressure coupling between the contacts of the integrated circuit package and the terminal pads of the backpanel. In the preferred embodiment, the connector includes a carrier member upon which the integrated circuit package is mounted and the carrier member has at least one boss extending normally therefrom into a hole formed through the backpanel. The boss of the carrier member has a headed stud extending coaxially therefrom so as to protrude through the hole in the backpanel. A mounting plate is located in contiguous engagement with the opposite surface of the backpanel with the headed stud of the carrier member extending into a special aperture formed through the mounting plate.

Abstract: A connector for demountably attaching a large scale integrated circuit package to a backpanel includes a base receptacle mounted on the backpanel with contact means therein which are in contact with the backpanel. In the preferred embodiment, the base receptacle is adapted to receive a leadless circuit package therein with the terminals of the package in alignment with the contact means of the base receptacle, and the base receptacle is provided with upstanding headed studs. A cover having apertures formed therein is mounted atop the base receptacle so that lateral movement of the cover relative to the base causes interaction of the studs with the apertures to load the terminals of the circuit package into conductive contact with the contact means of the base receptacle and to demountably lock the cover in place atop the base.

Abstract: An improved integrated circuit package and connector therefor. The circuit package is provided with a flexible stripline terminal integrally extending from at least one side thereof to serve as leads by which electrical interconnection is made with the internal circuitry thereof, and the connector is for demountably attaching that package to a backpanel. The connector includes a base receptacle mounted on the backpanel for aligningly receiving the integrated circuit package so that the stripline leads are in registry with terminal pads provided on the backpanel, and the base receptacle has headed studs upstanding therefrom. A cover having apertured inclined plane means formed therein is mounted atop the base receptacle so that lateral movement of the cover receptacle relative to the base results in interaction of the studs with the inclined planes to deflect the cover downwardly and lock it in place on the base.

Abstract: A connector for demountably attaching a leadless integrated circuit package to an electrically interconnecting backpanel includes a base receptacle mounted on the backpanel and having contact means therein which are in contact with the backpanel. The base receptacle is provided with upstanding headed studs and is adapted to receive the circuit package therein with the terminal pads of the package in alignment with the contact means of the base receptacle. A cover having apertured inclined planes formed therein is mounted atop the base receptacle so that lateral movement of the cover relative to the base causes interaction of the studs with the apertured inclined planes to load the terminal pads of the circuit package into conductive contact with the contact means of the base receptacle and to demountably lock the cover in place atop the base.

Abstract: A device which facilitates the handling, storage and shipment of a multilead integrated electronic package and provides a demountable solderless connector for attaching the package to a wiring panel.