Abstract: The present invention includes a method for performing a thermal analysis, including the steps of determining size and placement of each of a plurality of drivers on an integrated circuit device. The determined size and placement of each driver is stored as layout data and the layout data is converted into input for a finite element analysis program. The input is applied to the finite element analysis program, and the finite element analysis program is used to construct a finite element mesh of the integrated circuit device from the input. Additionally, material properties are assigned to the finite element mesh, and a thermal analysis is performed of the finite element mesh to generate data in a thermal analysis report.

Abstract: A protection device for handling energy transients includes a plurality of basic unit Zener diodes connected in series to achieve a desired breakdown voltage. Each of the basic unit Zener diodes is formed in a first-type substrate. Each of the basic unit Zener diodes comprises a second-type well formed in the substrate, a second-type Zener region formed in the second-type well and a first-type+ region formed over the second-type Zener region between a first and second second-type+ region.

Abstract: A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

Abstract: A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

Abstract: A glass envelope contains a silicon substrate which embodies an active matrix anode array, a microprocessor, and anode driving circuits. A small number of pins on the envelope couple display parameters and control signals to the microprocessor, and logic and anode signal voltages are supplied to the substrate. The microprocessor determines which pixels in the anode array should be energized and the driving circuit addresses the array and applies energizing voltage to the selected pixels. The driving circuit is supplied by the low signal voltage and includes a voltage level shifting function to increase the level by an order of magnitude to realize a voltage high enough for adequate display brightness. The display can be made small due to the small number of pins required.

Abstract: A single glass envelope contains fixed anode segments on the glass surface and a silicon substrate mounted on the same surface. The silicon substrate contains an active matrix vacuum fluorescent anode array as well as serial interface circuitry and a driver circuit for each of the AMVFD and the fixed segment display to minimize the number of input pins in the lead frame of the envelope. Aluminum traces on the glass surface are wire bonded to the substrate and extend to the fixed segments and to the lead frame pins.

Abstract: A vehicle anti-theft device is disclosed which includes an electronically erasable programmable read only memory (EEPROM) which stores a modifiable code which must be matched by an input code in order to start the vehicle. The ignition key includes a resistor pellet, engaged by contact in the ignition lock assembly, which is measured to provide the input code. To avoid problems associated with intermittent contact engagement with the resistor pellet, circuitry is provided to control the resistor measurement cycle.