Abstract: Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A computer system and method for synchronizing actions associated with media between a media/network device and peripherals. In an example implementation, a system includes a one or more processors configured to receive, by a communication module from a media/network device based on peripheral addressing information, a peripheral payload including a first set of actions and timing information related to media. The one or more processors perform the first set of actions based on the peripheral payload, generate response data for the first set of actions, and transmit the response data to the media/network device via a wireless network.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A method for producing hydrogen product having a low carbon intensity is provided. The method includes the steps of: (a) converting a hydrocarbon feedstock to a hydrogen product using a hydrocarbon reforming process; (b) providing at least some of the required energy for the hydrogen production process from a biomass power plant; and (c) processing one or more flue gas streams from the biomass power plant in a carbon capture unit to reduce CO2e emissions. The hydrogen product has a carbon intensity preferably less than about 1.0 kg CO2e/kg H2, more preferably less than 0.45 kg CO2e/kg H2, and most preferably less than 0.0 kg CO2e/kg H2.

Abstract: A VCSEL array may include a semiconductor substrate and a plurality of emitters on the substrate that conforms to an emitter pattern. The emitter pattern may be oriented at a non-zero angle to an edge of the substrate and may comprise two or more unit cells arranged to form the emitter pattern. Each unit cell, of the two or more unit cells, may include a same number of emitters, and the two or more unit cells may be arranged to cause a measurement of misalignment associated with two adjacent unit cells, of the two or more unit cells, to satisfy a misalignment threshold.

Abstract: In some implementations, an emitter module may include an emitter layer including a first emitter array configured to produce a first beam that provides flood illumination, and a second emitter array configured to produce a second beam that provides spot illumination. The emitter module may include a first optics layer, positioned in front of the emitter layer, that includes a first collimating lens positioned in front of the first emitter array, and a second collimating lens positioned in front of the second emitter array. The emitter module may include a second optics layer, positioned in front of the first optics layer, that includes an optical diffuser positioned in front of the first collimating lens, and a beamsplitter grating positioned in front of the second collimating lens.

Abstract: A diffractive optical element may include sub-wavelength period stack-and-gap structured layers providing transmissive phase delay at a wavelength. The sub-wavelength period stack-and-gap structured layers may include a set of thin anti-reflection layers that are index matched to an environment or a substrate over a range of fill factors of the sub-wavelength period.

Abstract: In some implementations, an optical system includes an emitter array including a plurality of emitters. The plurality of emitters are arranged in a plurality of channels and the emitter array is configured to illuminate on a per-channel basis. Respective positions of emitters, of the plurality of emitters, of a channel, of the plurality of channels, vary across a width of the channel. The optical system includes a lens to receive light from the emitter array and a diffuser to receive light from the lens. The diffuser is configured to diffuse light along a length of the plurality of channels of the emitter array. The optical system includes a corrective optical element to receive light from the diffuser.

Abstract: In some implementations, an optical device includes a two-zone vertical cavity surface emitting laser (VCSEL) with a set of emission zones configured to emit structured light forming a set of dots; a single-element collimating lens aligned to the two-zone VCSEL; and a tiling diffractive optical element (DOE) aligned to the single-element collimating lens, wherein the tiling DOE comprises a set of tile segments aligned to the set of emission zones, and wherein a tile segment, of the set of tile segments, is configured to project, from the set of emission zones toward portions of a target, the structured light forming the set of dots.

Abstract: A transmissive optical element may include a substrate. The transmissive optical element may include a first anti-reflectance structure for a particular wavelength range formed on the substrate. The transmissive optical element may include a second anti-reflectance structure for the particular wavelength range formed on the first anti-reflectance structure. The transmissive optical element may include a third anti-reflectance structure for the particular wavelength range formed on the second anti-reflectance structure. The transmissive optical element may include at least one layer disposed between the first anti-reflectance structure and the second anti-reflectance structure or between the second anti-reflectance structure and the third anti-reflectance structure.

Abstract: A structured light system includes a camera module and a dot projection module. The dot projection module includes a submount, an emitter array disposed on the submount, and a diffractive optical element (DOE) disposed over the emitter array. The emitter array includes a plurality of emitters arranged in a periodic emitter pattern and the emitter array is oriented at a non-zero angle relative to a rectilinear axis of the submount.

Abstract: An optical assembly includes an integrated circuit (IC) driver chip; an optical subassembly disposed on the IC driver chip that includes: a vertical cavity surface emitting laser (VCSEL) device, an optical element disposed above a top surface of the VCSEL device, and two or more attachment structures disposed between the VCSEL device and the optical element; and two or more additional attachment structures disposed between the IC driver chip and the optical subassembly. The VCSEL device includes: a cathode contact disposed on the top surface of the VCSEL device, and an anode contact disposed on the top surface of the VCSEL device. The optical element includes two or more conductive traces on a bottom surface of the optical element. The two or more attachment structures are disposed between the two or more conductive traces of the optical element, and the cathode contact and the anode contact of the VCSEL device.

Abstract: A zoned waveplate has a series of transversely stacked birefringent zones alternating with non-birefringent zones. The birefringent and non-birefringent zones are integrally formed upon an AR-coated face of a single substrate by patterning the AR coated face of the substrate with zero-order sub-wavelength form-birefringent gratings configured to have a target retardance. The layer structure of the AR coating is designed to provide the target birefringence in the patterned zones and the reflection suppression.

Abstract: A dot projector may include a vertical-cavity surface-emitting laser (VCSEL). The dot projector may include one or more collimating elements to collimate light emitted by the VCSEL. An effective focal length of the one or more collimating elements may be larger than an optics length of the dot projector. The dot projector may include an optical element including a periodic optical phase function to replicate the light after collimation by the one or more collimating elements and an aberration-correcting phase function to correct spot aberrations in a dot pattern resulting from the tiling or splitting of the light.

Abstract: In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

Abstract: An optical element may include a substrate. The optical element may include a first anti-reflectance structure for a particular wavelength range formed on the substrate. The optical element may include at least one layer disposed on a portion of the first anti-reflectance structure. The optical element may include a second anti-reflectance structure for the particular wavelength range formed on the at least one layer. A depth between a first surface of the first anti-reflectance structure and a second surface of the second anti-reflectance structure, a first index of refraction of the first anti-reflectance structure, a second index of refraction of the second anti-reflectance structure, and a third index of refraction of the at least one layer may be selected to form a diffractive optical element associated with a particular phase delay for the particular wavelength.