Abstract: An example modular backplane device that transforms signals is described. The example disclosed herein comprises a plurality of interface connectors evenly distributed on a first side of a housing of the modular backplane to transfer a plurality of first signals. The example further comprises one or more aggregation point connectors on an edge of the first side of the housing of the modular backplane to transfer data, transfer management information, and receive electrical power. The modular backplane device example also comprises a logic board coupled to the plurality of interface connectors and to the one or more aggregation point connectors. The logic board is to transform signals and comprises signal transformation logic and a management processor.

Abstract: One example of a cable assembly includes a cable and a cable connector attached to one end of the cable. The cable connector generally includes latching features to couple the cable connector to a receptacle. The cable assembly includes a sleeve enclosed around at least a portion the cable and pull-tabs disposed along a perimeter of a first end of the sleeve. As an example, at least one of the pull-tabs is accessible to actuate the latching features when the cable connector is to disengage from the receptacle. The cable assembly includes attachment features to couple the sleeve to the latching features, wherein the attachment features are to actuate the latching features when at least one of the pull-tabs is pulled.

Abstract: An optical assembly is provided that includes a base sub-assembly a mounting point for an optical socket connector. The optical assembly further comprises a cover sub-assembly to be coupled to the base sub-assembly and a carrier to receive an optical fiber ferrule and permit opto-mechanical coupling between the optical fiber ferrule and the optical socket connector when the base-sub assembly is coupled to the cover sub-assembly.

Abstract: In one example, a cage assembly can include a receiver portion to receive an electrical cable. The cage assembly can include a sidewall portion to encase the electrical cable and protect the electrical cable from electro-mechanical interference (EMI). The cage assembly can include an attachment portion to attach to a printed circuit board (PCB). The cage assembly can include a lower portion comprising an aperture that the electrical cable exits through to be mechanically attached to the PCB.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A storage drive riser may include a riser board. The riser board may include an edge connector, a storage drive connector to operably engage with a storage drive, and a retention aperture. The retention aperture may be longitudinally aligned with the storage drive connector. The storage drive riser may also include a storage drive retainer to insertably engage with the retention aperture and to retain the storage drive to the riser board with a retention protrusion.

Abstract: In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.

Abstract: Example alignment members are provided herein. In one example, the alignment member includes a frame member, a stiffener member, a bracket member, and a spring member. The frame member includes a set of roller bushings. The stiffener member includes a set of cam members. The bracket member to receive the stiffener member. The spring member is connected to the stiffener member. The spring member to expand and contract based on the position of the set of roller bushings.

Abstract: Examples herein disclose a plug coupleable to a connector housing on a computing device. The examples disclose an electrical contact supported by the plug, the electrical contact interfaceable with a connector pin in the connector housing, wherein the computing device is to detect the interfaceability of the electrical contact with the connector pin, the detection of the interfaceability is to indicate an installation of the plug within the connector housing.

Abstract: A dual in-line memory module (DIMM) connector can include a double data rate fourth generation (DDR4) DIMM connector to connect to a DIMM via a lowest notch of the DIMM relative to an electronic component on which the DIMM is located.

Abstract: Examples herein disclose an apparatus for securing or disengaging a blade server in an enclosure. The apparatus includes a worm gear and a cam gear. The worm gear includes a number of threads to interact with a number of teeth on the cam gear. The cam gear includes the number of teeth to interact with the number of threads and a latch. The latch rotates based on the number of threads interacting with the number of teeth such that the rotation secures or disengages the blade server from the enclosure.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: Examples relate to a pluggable non-volatile memory (NVM) drive comprising a printed circuit assembly (PCA) that in turn comprises a connector, at least one NVM chip and a memory semantic fabric media controller connected to the at least one NVM chip. In some examples, the memory semantic fabric media controller is to provide a memory semantic interface between the at least one NVM chip and a computing network device to which the pluggable NVM drive is plugged.

Abstract: Examples described herein include optical adapters. In some examples, an optical connector adapter includes a housing with a first end and a second end, a latch assembly inside the housing, and an adapter optical ferrule. The latch assembly may include two latch arms and an engagement feature to mate the adapter to a number of optical transceiver shells. The engagement feature may protrude beyond the second end of the housing. The adapter optical ferrule is attached to the two latch arms.

Abstract: An example modular backplane device that transforms signals is described. The example disclosed herein comprises a plurality of interface connectors evenly distributed on a first side of a housing of the modular backplane to transfer a plurality of first signals. The example further comprises one or more aggregation point connectors on an edge of the first side of the housing of the modular backplane to transfer data, transfer management information, and receive electrical power. The modular backplane device example also comprises a logic board coupled to the plurality of interface connectors and to the one or more aggregation point connectors. The logic board is to transform signals and comprises signal transformation logic and a management processor.

Abstract: Examples herein relate to non-volatile memory (NVM) drives. In one example, an NVM drive comprises a housing to support one or more printed circuit assemblies (PCA's), the housing comprising a front portion, a rear portion and a heat sink, a PCA disposed within the housing, the PCA comprising a connector, one or more NVM chips and a controller attached to the one or more NVM chips. The PCA is centered in the housing, the NVM drive is hot-plugged into a fabric attached memory pool or local to a server by the rear portion of the housing, and the NVM drive hot-plugged in the fabric attached memory pool is accessible by the front portion of the housing.

Abstract: One example of a removable module includes an optical transceiver, optical cables, electrical cables, a power conditioner, and a housing. The optical transceiver converts optical signals received through an optical cable to electrical signals to distribute to a plurality of computing devices through electrical cables and converts electrical signals received from the plurality of computing devices through the electrical cables to optical signals to transmit through the optical cable. The power conditioner receives power from a system with the removable module installed in the system to provide power to the optical transceiver. The housing encloses the optical transceiver and the power conditioner and includes an air intake port and an air exhaust vent. The housing is received by a bay of the system, which provides an interface to the power conditioner and provides air to the air intake port with the removable module installed in the system.

Abstract: One example of a system includes a printed circuit board. The printed circuit board includes a switch chip footprint to receive a higher lane count switch chip or a lower lane count switch chip. The printed circuit board includes a plurality of transceiver module footprints. Each transceiver module footprint is electrically coupled to the switch chip footprint. Each transceiver module footprint may receive a higher lane count transceiver module or a lower lane count transceiver module.

Abstract: Examples described herein include optical connectors with different positions. In some examples, an electronic device comprises a housing, an optical fiber, and a first optical connector secured to the optical fiber. The housing may have a first wall. The optical fiber may be within the housing. The first optical connector may be moveable between a first position and a second position along the first wall.

Abstract: Examples described herein include optical connectors with different positions. In some examples, an electronic device comprises a housing, an optical fiber, and a first optical connector secured to the optical fiber. The housing may have a first wall. The optical fiber may be within the housing. The first optical connector may be moveable between a first position and a second position along the first wall.