Abstract: Novel phosphorus element-containing vinyl ester resin compositions and process for preparing epoxy vinyl ester resin compositions include non-halogenated, ignition resistant epoxy vinyl ester resin formulations. The ignition resistant epoxy vinyl ester resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.

Abstract: Novel phosphorus element-containing vinyl ester resin compositions and process for preparing epoxy vinyl ester resin compositions include non-halogenated, ignition resistant epoxy vinyl ester resin formulations. The ignition resistant epoxy vinyl ester resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.

Abstract: Novel phosphorus element-containing epoxy resin compositions and novel phosphorus-element containing epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds including non-halogenated, ignition resistant epoxy resin formulations. The ignition resistant epoxy resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.

Abstract: The invention relates to epoxy resin compositions. More specifically, the invention is a composition suitable to cure an epoxy resin, preferably in a solvent, incorporating a cross-linking compound of a polycarboxylic acid anhydride or a copolymer of styrene and hydroxystyrene. Also, the invention relates to an epoxy resin composition comprising an inhibitor effective to extend the gel time of the composition at curing temperatures from 150° C. to 170° C., and a cross-linking compound as described.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including:

Abstract: Novel phosphorus element-containing crosslinking agents for epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds. Epoxy resins cured or crosslinked with the crosslinking agents of this invention yield non-halogenated, ignition resistant epoxy resin formulations. The ignition resistant epoxy resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.

Abstract: A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing cross-linking agent having an amine functionality of at least 2 and a catalyst capable of promoting the reaction of the phosphoric acid ester with the epoxy resin and promoting the curing of the epoxy resin with the cross-linker, and optionally a Lewis acid in a stated amount.

Abstract: An essentially water-free solvent system comprising methoxy acetone and an organic protic solvent is useful as a solvent fora) a curing agent for an epoxy resin and/orb) a curing catalyst and/orc) a cure inhibitor.

Abstract: A solvent system contains methoxy acetone, water and, optionally, an oxygen-containing solvent other than methoxy acetone, such as a propylene glycol monoether or diether. The solvent system is a useful solvent for a curing agent for an epoxy resin, a curing catalyst and/or a cure inhibitor. A solution of the curing agent, the curing catalyst and/or the cure inhibitor in the solvent system can be mixed with an epoxy resin, optionally dissolved in a solvent, for producing a one-component epoxy resin composition.