Abstract: An electrically conductive enclosure, consisting of side, top, and bottom members, extends between a ground conductor on a backpanel and electrically conductive faceplates at front edges of circuit boards inserted into connectors on the backpanel and guided by channels in the top and bottom members, thereby forming an EMI-screened arrangement. To provide effective EMI screening, resilient electrically conductive strips are provided between the faceplates and the enclosure, and adjacent faceplates are electrically interconnected. In order to avoid excessive lateral forces on the faceplates, the interconnections therebetween are provided by electrically conductive clips provided in and projecting from a slot in one side of each faceplate.