Abstract: A modified structure of an n-channel lateral double-diffused metal oxide semiconductor (LDMOS) transistor is provided to suppress the rupturing of the gate-oxide which can occur during the operation of the LDMOS transistor. The LDMOS transistor comprises a dielectric isolation structure which physically isolates the region comprising a parasitic NPN transistor from the region generating a hole current due to weak-impact ionization, e.g., the extended drain region of the LDMOS transistor. According to an embodiment of the disclosure, this can be achieved using a vertical trench between the two regions. Further embodiments are also proposed to enable a reduction in the gain of the parasitic NPN transistor and in the backgate resistance in order to further improve the robustness of the LDMOS transistor.

Abstract: A modified structure of an n-channel lateral double-diffused metal oxide semiconductor (LDMOS) transistor is provided to suppress the rupturing of the gate-oxide which can occur during the operation of the LDMOS transistor. The LDMOS transistor comprises a dielectric isolation structure which physically isolates the region comprising a parasitic NPN transistor from the region generating a hole current due to weak-impact ionization, e.g., the extended drain region of the LDMOS transistor. According to an embodiment of the disclosure, this can be achieved using a vertical trench between the two regions. Further embodiments are also proposed to enable a reduction in the gain of the parasitic NPN transistor and in the backgate resistance in order to further improve the robustness of the LDMOS transistor.

Abstract: The disclosed technology relates generally to semiconductor devices, and more particularly to semiconductor devices including a metal-oxide-semiconductor (MOS) transistor and are configured for accelerating and monitoring degradation of the gate dielectric of the MOS transistor. In one aspect, a semiconductor device configured with gate dielectric monitoring capability comprises a metal-oxide-semiconductor (MOS) transistor including a source, a drain, a gate, and a backgate region formed in a semiconductor substrate. The semiconductor device additionally comprises a bipolar junction transistor (BJT) including a collector, a base, and an emitter formed in the semiconductor substrate, wherein the backgate region of the MOS transistor serves as the base of the BJT and is independently accessible for activating the BJT.