Abstract: Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.

Abstract: An apparatus is provided and includes a housing, including a housing mating device, through which an installation path for an assembly is defined with a space in which a first part is positioned, a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed, and a hub, in which a hub mating device is defined, and from which a two-stage mating device extends, the two-stage mating device including first and second elastically coupled stages. The hub and the backplane body are coupled to form the assembly and the assembly is installed/removed in/from the space with the second stage of the two-stage mating device elastically hooked by the housing mating device or released from the housing mating device and the first and second stages of the two-stage mating device biasing the hub and the backplane body to remain coupled.

Abstract: A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.